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A kind of manufacturing method of multi-layer leadless golden finger circuit board

A production method and circuit board technology, applied in multilayer circuit manufacturing, printed circuit manufacturing, removing conductive materials by chemical/electrolytic methods, etc., can solve problems such as product scrapping, high production costs, and long production processes, and achieve production Low cost, short process, and the effect of reducing production costs

Inactive Publication Date: 2015-08-12
广东达进电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the existing golden finger circuit board, during the production process, when etching the leads, the dry film is difficult to completely cover the gap between the lines and the lines on the same plane, and the liquid medicine penetrates into the dry film from the gap between the wires and bites the lines, which will lead to the problem of product scrapping, and The existing golden finger circuit board needs to go through the process of pasting the dry film and etching the leads. The production process is relatively long and the production cost is relatively high.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] A method for manufacturing a multilayer leadless golden finger circuit board of the present invention comprises the following steps:

[0040] A. Cutting: Cut the board to meet the design requirements;

[0041] B. Sticking film: Paste photosensitive dry film on the plate of step A as the inner layer;

[0042] C. Inner layer graphics transfer: transfer the circuit diagram on the film to the board with photosensitive dry film;

[0043] D. Inner layer pattern etching: use etching solution to remove the exposed part of the copper layer on the board surface that is not protected by the photosensitive dry film, and keep the copper layer as the circuit;

[0044] E. Removing the dry film: remove all the photosensitive dry film on the board surface in step D, and expose the copper layer as the circuit;

[0045] F. Graphic inspection: Use a scanning instrument to check the open and short circuits of the circuit on the board in step E;

[0046] G. Browning: roughening the copper...

Embodiment 2

[0066] A method for manufacturing a multilayer leadless golden finger circuit board of the present invention comprises the following steps:

[0067] A. Cutting: Cut the board to meet the design requirements;

[0068] B. Sticking film: Paste photosensitive dry film on the plate of step A as the inner layer;

[0069] C. Inner layer graphics transfer: transfer the circuit diagram on the film to the board with photosensitive dry film;

[0070] D. Inner layer pattern etching: use acidic CuCl 2 Remove the exposed part of the copper layer on the board surface that is not protected by the photosensitive dry film, and keep the copper layer as the circuit;

[0071] E. Removal of dry film: Use NaOH film stripping solution to remove all the photosensitive dry film on the board surface in step D, and expose the copper layer as the circuit;

[0072] F. Graphic inspection: Use a scanning instrument to check the open and short circuits of the circuit on the board in step E;

[0073] G. Br...

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PUM

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Abstract

The invention discloses a method for manufacturing multilayer leadless golden-finger circuit boards. The method is characterized by including the following steps of cutting, film coating, inside-pattern transferring, inside-pattern etching, dry film removing, pattern checking, browning, pressing and laminating, pressing, mechanical drilling, PTH (plating through hole), plate electroplating, outer dried film coating, outside-pattern transferring, pattern electroplating, outside-pattern etching, gold plating, outside-pattern checking, green oil coating, character printing, forming, electric logging, surface treating, final checking and packaging. In order to overcome the defects of the prior art, the method for manufacturing multilayer leadless golden-finger circuit boards, simple in process and lower in production cost, is provided.

Description

technical field [0001] The invention relates to a method for manufacturing a multilayer leadless gold finger circuit board. Background technique [0002] In the existing golden finger circuit board, during the production process, when etching the leads, the dry film is difficult to completely cover the gap between the lines and the lines on the same plane, and the liquid medicine penetrates into the dry film from the gap between the wires and bites the lines, which will lead to the problem of product scrapping, and Existing golden finger circuit boards need to go through the processes of pasting dry film and etching leads, and the production process is relatively long and the production cost is relatively high. Contents of the invention [0003] The object of the present invention is to overcome the deficiencies in the prior art and provide a method for manufacturing a multi-layer leadless golden finger circuit board with simple process and relatively low production cost. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/06H05K3/46
Inventor 王斌陈华巍朱瑞彬谢兴龙罗小华
Owner 广东达进电子科技有限公司