High-temperature solidifying furnace

Abstract

The invention discloses a high-temperature solidifying furnace. The high-temperature solidifying furnace comprises a heating cavity, a heater and a temperature monitoring system, wherein the heater comprises a plurality of heating modules which can be controlled independently; and the temperature monitoring system comprises a thermocouple for monitoring the internal ambient temperature information of the heating cavity, an infrared monitoring device for monitoring temperature information on the surface of each layer of substrate inside the heating cavity and generating a temperature signal, a signal processing module for performing signal connection of the thermocouple and the infrared monitoring device and generating a corresponding execution command when a substrate with temperature abnormality is judged according to the temperature information fed back by the thermocouple and the temperature signal fed back by the infrared monitoring device, and an executing module in signal connection with the signal processing module and regulating the heating power of a heating module corresponding to the substrate with the temperature abnormality according to the execution command generated by the signal processing module. The high-temperature solidifying furnace monitors the ambient temperature of the heating cavity and the temperature on the surface of the substrate through the thermocouple and the infrared monitoring device, so that the solidifying temperature monitoring precision is improved.

Description

technical field [0001] The invention relates to the technical field of production and processing equipment for liquid crystal display devices, in particular to a high-temperature curing furnace. Background technique [0002] The high-temperature curing furnace is a high-temperature curing equipment for curing the sealing glue between the substrates behind the box of the liquid crystal display device in the liquid crystal drop filling (ODF, One Drop Filling) process. [0003] Such as figure 1 as shown, figure 1 It is a schematic diagram of the distribution structure of heaters and thermocouples in a high-temperature curing furnace in the prior art. [0004] The high-temperature curing furnace includes a heating chamber 1 , a heater 2 for heating the heating chamber 1 , and a temperature monitoring system for monitoring the curing temperature inside the heating chamber 1 . [0005] In the prior art, the schematic diagram of the temperature monitoring system used in the high...

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Problems solved by technology

[0007] However, the thermocouple 3 can only monitor the ambient temperature in the heating chamber 1 of the high-temperature curing furnace, but cannot monitor the temperature on the surface of the substrate. Moreover, the thermocouple 3 has a certain delay in the perception of temperature changes, and is not suitable for high-temperature curing. The monitoring accuracy of the curing temperature of the substrate in the furnace heating chamber 1 is poor

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