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High-temperature solidifying furnace

A high-temperature curing and temperature information technology, applied in radiation pyrometry, furnaces, thermometers, etc., can solve the problems of poor monitoring accuracy of the curing temperature of the substrate and the inability to monitor the surface temperature of the substrate, and achieve the effect of improving the monitoring accuracy

Inactive Publication Date: 2014-12-10
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, the thermocouple 3 can only monitor the ambient temperature in the heating chamber 1 of the high-temperature curing furnace, but cannot monitor the temperature on the surface of the substrate. Moreover, the thermocouple 3 has a certain delay in the perception of temperature changes, and is not suitable for high-temperature curing. The monitoring accuracy of the curing temperature of the substrate in the furnace heating chamber 1 is poor

Method used

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Embodiment Construction

[0042] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0043] Please refer to image 3 and Figure 4 ,in, image 3 A schematic diagram of the internal structure of the heating chamber of the high-temperature curing furnace provided by the present invention; Figure 4 It is a schematic diagram of the principle of the temperature monitoring system in the high-temperature curing furnace provided by the present invention.

[0044] The high-temperature curing furnace provided by the present invention includes a heat...

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Abstract

Embodiments of the invention provide a high temperature curing oven, comprising: a heating cavity a heater and a temperature monitor system. The heater includes a plurality of heating modules that can be controlled independently. The temperature monitor system includes: a thermocouple; an infrared monitor device; a signal processing module; and an executing module.

Description

technical field [0001] The invention relates to the technical field of production and processing equipment for liquid crystal display devices, in particular to a high-temperature curing furnace. Background technique [0002] The high-temperature curing furnace is a high-temperature curing equipment for curing the sealing glue between the substrates behind the box of the liquid crystal display device in the liquid crystal drop filling (ODF, One Drop Filling) process. [0003] Such as figure 1 as shown, figure 1 It is a schematic diagram of the distribution structure of heaters and thermocouples in a high-temperature curing furnace in the prior art. [0004] The high-temperature curing furnace includes a heating chamber 1 , a heater 2 for heating the heating chamber 1 , and a temperature monitoring system for monitoring the curing temperature inside the heating chamber 1 . [0005] In the prior art, the schematic diagram of the temperature monitoring system used in the high...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05D3/02B05D3/14G02F1/1339
CPCG01J5/047G01J5/0044G01J5/0066F26B23/06F26B25/06G01J2005/0077G02F1/1303G01K13/00G01J5/084F27D11/02F27B5/18F27D2019/0003
Inventor 井杨坤
Owner BOE TECH GRP CO LTD