Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Small NTC (Negative Temperature Coefficient) thermistor with glass-sealed diode structure and preparation method thereof

A technology of glass-encapsulated diodes and thermistors, applied in the direction of resistors, resistor parts, resistor terminals/electrodes, etc., can solve the problems of inability to use temperature sensors and meet the miniaturization of temperature measurement and sensor devices, and achieve easy batch production The effect of rapid production, low production cost, and small product size and structure

Active Publication Date: 2015-03-18
XIAOGAN HUAGONG GAOLI ELECTRONICS
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

After bending, its size is close to 3mm, and it cannot be used in epoxy-encapsulated and shell-encapsulated temperature sensors below φ4mm, and cannot meet the requirements of miniaturized temperature sensor devices.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Small NTC (Negative Temperature Coefficient) thermistor with glass-sealed diode structure and preparation method thereof
  • Small NTC (Negative Temperature Coefficient) thermistor with glass-sealed diode structure and preparation method thereof
  • Small NTC (Negative Temperature Coefficient) thermistor with glass-sealed diode structure and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0017] refer to figure 1 , The small glass-encapsulated diode structure NTC thermistor of the present invention is made of long and short Dumet wires 3,6, a glass bulb and a diode structure NTC thermal chip 4, the glass bulb 5 is 2.55mm long and has an outer diameter of 1.35mm. The long and short Dumet wires 3 and 6 are two identical Dumet wire electrode leads.

[0018] The concrete steps of preparation method of the present invention are as follows:

[0019] 1) Prepare NTC thermosensitive ceramics 1 by using transition metal oxides such as Mn, Co, Ni, Fe, Cu, etc. according to the electronic ceramic preparation process;

[0020] 2) Print the silver electrode paste onto the NTC heat-sensitive ceramic substrate through screen printing, burn in at 850°C for 10-15 minutes, and cover the upper and lower surfaces of the ceramic substrate with a layer of silver electrode 2 with a thickness of 8-15 μm;

[0021] 3) Cut the NTC thermosensitive electrode sheet 2 into 0.35-0.45mm squar...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a small NTC (Negative Temperature Coefficient) thermistor with a glass-sealed diode structure and a preparation method thereof. The NTC thermistor is characterized in that two Dumet wires clamp an NTC thermo-sensitive chip; the exterior is encapsulated with a glass bulb; the total length is 7mm; the length of the glass bulb is 2.55mm; the external diameter is 1.35mm; after the glass bulb and the long Dumet wire are bent, the total width is 1.8mm; the space between the long Dumet wire and the short Dumet wire is 1.28mm; and the diameter of each Dumet wire is 0.3mm. The preparation method is as follows: preparing NTC thermo-sensitive ceramic according to an electronic ceramic preparation process; after printing a silver electrode through a silk screen, firing the electrode; cutting the electrode into the NTC thermo-sensitive chip; filling the NTC thermo-sensitive chip into the glass bulb through a graphite mould, clamping two ends by the two Dumet wires, and encapsulating at a high temperature; and bending the long Dumet wire along the root of the glass bulb, and cutting out the excessive part to obtain a product, wherein the total width is 1.8mm after the glass bulb and the long Dumet wire are bent. The small NTC thermistor with the glass-sealed diode structure is small in dimension and structure, low in production cost and easy to produce massively, and can be widely applied for a temperature sensor below phi 3mm to phi 4mm, with an epoxy encapsulation and case filling-sealing structure.

Description

technical field [0001] The invention relates to an NTC thermistor, in particular to a small glass-encapsulated diode structure NTC thermistor and a preparation method thereof. Background technique [0002] At present, there are three types of NTC thermistors that are common on the market: single-ended glass-encapsulated bead type, glass-encapsulated diode type with axial leads at both ends, and radial solder tab epoxy-encapsulated AT type. Single-ended glass-encapsulated bead type, radial soldering tab epoxy-encapsulated AT type have low production efficiency and low output. [0003] Both ends of the glass-sealed diode type NTC thermistor are axially drawn out. The DO35 glass-sealed diode structure thermal sensor is composed of two Dumet wires, a glass bulb and a diode-structured NTC thermal chip. First, a silk wire 3 The big end of the end face is put into the graphite mold upwards, and then the glass bulb 5 is loaded into the same graphite mold through tooling, wherein th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01C7/04H01C1/026H01C1/14
Inventor 周煜阳星陆峰王瑞兵
Owner XIAOGAN HUAGONG GAOLI ELECTRONICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products