Ldmos device with stepped multiple discontinuous field plates and manufacturing method
A stepped, field plate technology, used in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve the problem of single distance between the field plate and the device surface, and achieve the effect of increasing doping concentration and improving on-resistance
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[0031] The structure of the LDMOS device with stepped multiple discontinuous field plates described in this embodiment is as follows figure 2 As shown, it includes a semiconductor body 1, the semiconductor body 1 includes a lowermost P-type heavily doped substrate 12, a P-type epitaxial layer 13 on the P-type heavily doped substrate 12, and an uppermost semiconductor dielectric layer 3 A P-type heavily doped source region 15, a P-type doped channel region 16, an N-type doped drain drift region 11 and an N-type heavily doped drain region 18 are formed between the P-type epitaxial layer 13 and the semiconductor dielectric layer 3 , where the P-type heavily doped source region 15 and the P-type doped channel region 16 are connected to form an N-type heavily doped source region 17 . Between the P-type heavily doped source region 15 and the P-type heavily doped substrate, a P-type doped connection or a trench 14 filled with a conductor is arranged, and the P-type doping in the tre...
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