Coil cooler arranged in heating zone

A technology of cooler and heating zone, applied in metal processing, printed circuit and other directions, can solve the problem of water leakage of radiator, and achieve the effect of simple installation method, convenient maintenance and simple structure

Active Publication Date: 2014-09-03
上海朗仕电子设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This function is to install a small radiator in the heating zone, and pass water through it, so as to obtain a lower temperature in the heating zone and distinguish it from the temperature of other heating zones. However, a big disadvantage of it is that the The radiator has a serious leaking problem

Method used

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  • Coil cooler arranged in heating zone
  • Coil cooler arranged in heating zone

Examples

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Embodiment

[0022] A coil type cooler arranged in the heating area, its structure is as follows figure 1 As shown, the cooler is set on one side of the heating zone 1 of the reflow oven. The cooler includes a mounting plate 2, a stainless steel hose coil 3, a coil fixing device 4 and a fixing plate 5. The mounting plate 2 is arranged on the stainless steel hose coil 3. Above, the coil fixing device 4 fixedly installs the stainless steel hose coil 3 on the base plate, and the fixing plate 5 is fixed on the side of the stainless steel hose coil 3 through fixing screws 6 .

[0023] The structure of the stainless steel hose coil 3 is as follows figure 2 As shown, the stainless steel hose coil 3 is obtained by winding the whole stainless steel hose, the upper and lower ends of the stainless steel hose coil 3 are respectively connected to the cooling water inlet pipe and the cooling water outlet pipe through screws, and the coil fixing device 4 is a cross-shaped structure , pierced in the sta...

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PUM

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Abstract

The invention relates to a coil cooler arranged in a heating zone. The coil cooler is arranged at one side of the heating zone of a reflow oven and comprises a mounting plate, a stainless steel hose coil, a coil fixing device and a fixing plate, wherein the mounting plate is arranged above the stainless steel hose coil; the coil fixing device is used for fixedly mounting the stainless steel hose coil on a base plate; and the fixing plate is fixed to the side part of the stainless steel hose coil through a fixing screw. Compared with the prior art, the coil cooler arranged in the heating zone is safe and reliable, simple in structure, and convenient to mount and overhaul; therefore, better cooling effect can be achieved.

Description

technical field [0001] The invention relates to a cooling device, in particular to a coil type cooler arranged in a heating area. Background technique [0002] Reflow Oven (Reflow Oven) is a device used to solder circuit boards carrying electronic components. It provides a heating environment to heat and melt the solder paste so that surface mount components and circuit boards are reliably bonded together through the solder paste alloy. The solder paste used for brazing is made of fat-like flux and powder solder into a paste, which is applied to the soldering parts of the components of the circuit board by printing, and the electronic components are precisely mounted on it, and the reflow oven is used to Heat and melt to achieve reliable brazing of components. [0003] The flux in solder paste is usually a mixture of rosin as the main component, which is an auxiliary material to ensure the smooth progress of the brazing process. The main function of the flux is to remove ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K3/00B23K101/42
Inventor 詹姆斯·内维尔大卫·海乐初剑英
Owner 上海朗仕电子设备有限公司
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