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ic package stiffener with beam

A technology of stiffeners and integrated circuits, applied in the field of area array packaging, can solve the problems of increased cost and weight of IC packaging, increased intervals, and hindering IC heat dissipation.

Inactive Publication Date: 2016-04-20
ALCATEL LUCENT SAS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Going too thick is undesirable for a stiffener that is supported on top of the IC, because a thick stiffener that is on top of the IC and increases the thickness of the IC makes the overall assembled IC package thicker, thus potentially limiting IC package setup options and / or increase the separation of printed circuit cards from printed circuit cards in the final system assembly
Additionally, the increased stiffener thickness increases the IC die-to-lid spacing, creating a larger separation that needs to be filled with thermal interface material, ultimately preventing heat dissipation from the IC
Also, because of the perfectly flat cross-sectional profile of the stiffener, although it increases the overall volume of the material, the increase in stiffness is not effectively achieved, thus adding additional cost and weight to the final IC package

Method used

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  • ic package stiffener with beam
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Examples

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Embodiment Construction

[0022] Referring now to the drawings, wherein like numerals refer to like components or steps, there are disclosed aspects of various exemplary embodiments.

[0023] Many embodiments relate to a stiffener that may be attached to an integrated circuit (IC) package, where the stiffener includes structures having dimensions in directions other than in a plane of the top of the IC. As used throughout this document, the terms IC (integrated circuit) and IC package are used interchangeably to refer to an entire assembly of components, which is also commonly referred to as an IC package. Examples of IC packages include, for example, TSOPS, QFP, SOIC, BGA, CCGA, and the like. Note that with the ~400 connections above, the IC package is almost entirely in the area array style package format, which itself can include various subtypes such as pillar grid array (CCGA), pin grid array (PGA), and ball grid array (BGA) . The stiffener solutions described here are applicable to such area ar...

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Abstract

Various exemplary embodiments relate to stiffeners for integrated circuits (ICs). A stiffener may be attached to the IC and may utilize a planar portion and one or more beam portions protruding from the planar portion at a non-zero angle. Optionally, the stiffener may comprise a frame formed by beam portions adjacent the sides of the IC. Stiffeners may provide additional stiffness to the IC package to prevent warping of the IC during soldering.

Description

technical field [0001] The various exemplary embodiments disclosed herein relate generally to the fields of integrated circuits (ICs) and IC packaging and their manufacture and to the field of area array packaging. Background technique [0002] A wide variety of semiconductor chips with integrated circuits (ICs) are known in the industry. Some examples of ICs include Application Specific Integrated Circuits (ASICs) and Application Specific Standard Products (ASSPs). Generally, over time, ICs and their packaging have become more complex, with the result that their power, speed and / or their size have increased. Also attached are ICs that have a number of leads that are individually soldered to mounting locations on a circuit board or other base component. In some instances, all of these solder connections may stop without being fully fabricated. This is even more true if the IC is not perfectly flat, so it is typically mounted to a planar mounting surface. [0003] Warpage...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/16
CPCH01L23/16H01L2224/73153H01L2924/14H01L2924/1433H01L2924/3511
Inventor P·J·布朗A·尚
Owner ALCATEL LUCENT SAS
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