LED lamp strip structure and manufacturing method thereof

Abstract

An LED lamp strip structure comprises a substrate, a plurality of light emitting diode chips arranged on the substrate, and a fluorescent layer enclosing the light emitting diode chips. The fluorescent layer comprises a plurality of first portions and a plurality of second portions, wherein the first portions are arranged right above the light emitting diode chips, and the second portions are connected between every two adjacent first portions. The concentration of fluorescent powder inside the first portions is higher than that of the fluorescent powder in the second portions. The invention further relates to a manufacturing method of the LED lamp strip structure.

Description

technical field [0001] The invention relates to a semiconductor structure, in particular to an LED light bar structure and a manufacturing method thereof. Background technique [0002] In the current packaging structure of light-emitting diodes, fluorescent materials are often doped inside the packaging colloid or a fluorescent layer is formed on the surface of the packaging colloid. The light emitted by the light-emitting diodes excites different fluorescent materials to emit light, thereby obtaining light of the desired color. When a fluorescent layer is formed on the surface of the encapsulating colloid, due to the different light intensities at different light emitting positions, for example, the light intensity directly above the light-emitting diode is higher, and the light intensity at the position deviated from the directly above is lower, resulting in different light emitting positions. The different conversion ratios lead to chromatic aberration in the final output...

AI Technical Summary

Problems solved by technology

When a fluorescent layer is formed on the surface of the encapsulating colloid, due to the different light intensities at different light emitting positions, for example, the light intensity directly above the light-emitting diode is higher, and the light intensity at the position deviated from directly above is lower, resulting in different light emitting positions. Different conversion ratios lead to chromatic aberration in the final output of the light-emitting diode package structure, making the color uniformity of the output light poor

Especially for the chip on board package (COB, Chip On Board) light bar structure in the LED packaging structure, due to its large light emitting surface, it is easier to produce a large color difference, resulting in poor uniformity of the light emitting color. This restricts its application in fields with high requirements for the uniformity of light output color

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