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Automatic packing device for crystalline grains and method thereof

An automatic packaging and automatic packaging technology, applied in packaging, packaging protection, paper product packaging, etc., can solve the problems of manpower requirements, difficult to see crystal grains, easy to ignore, overturned and damaged, etc.

Active Publication Date: 2015-04-22
KING YUAN ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, for online operators, it is still very difficult and strenuous to visually inspect extremely small dies, even with a large square mirror. Not only is it difficult to see clearly where the dies are placed in the tray state, and it is very easy to ignore the abnormality of die placement or the situation of missed inspection
In addition, the use of eyes for a long time to inspect small crystal grains will easily make the eyes of the line operator tired, and they need to rest before continuing. Therefore, the detection efficiency is often poor.
[0006] (2) Secondly, since the strapping operation needs to be carried out manually by the online operator, not only does it result in a large demand for manpower, but also the efficiency of the operation is relatively low, which easily leads to insufficient output and production capacity.
[0007] (3) In addition, the belt packaging operation is carried out manually, and the objects operated are small-sized items such as crystal grains and trays, which are easy to be ignored, overturned and damaged. Overturned or damaged due to personnel negligence

Method used

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  • Automatic packing device for crystalline grains and method thereof
  • Automatic packing device for crystalline grains and method thereof
  • Automatic packing device for crystalline grains and method thereof

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Embodiment Construction

[0034]Some embodiments of the invention are described in detail below. However, the invention can be broadly practiced in other embodiments than this detailed description. That is to say, the scope of the present invention is not limited by the proposed embodiments, but is subject to the patent scope of the present invention. Secondly, when each element or step in the illustrations of the embodiments of the present invention is described as a single element or step, it should not be regarded as a limited cognition, that is, when the following description does not particularly emphasize the limitation on the number of the present invention The spirit and scope of application of the invention can be extended to structures and methods in which multiple elements or structures coexist. Furthermore, in this specification, different parts of each element are not drawn in full scale, and some dimensions are exaggerated or simplified compared with other relevant dimensions, so as to p...

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Abstract

The invention relates to an automatic packing device for crystalline grains and a method thereof, and especially relates to a packing device used for performing automatic detection, piling and strap packing, and the method thereof. The automatic packing device for crystalline grains uses an automated machine in replace of detecting crystalline grains with bare eyes and operations such as manually performed cover materials placement, charging tray piling, upper cover placemeng and strap packing, therefore obtaining aims of saving manpower cost, increasing output and efficiency of packing, preventing careless mistakes or loss caused by human operation, etc.

Description

technical field [0001] The present invention relates to an automatic packaging device and method for crystal grains, in particular to a packaging device and method for automatic detection, stacking and tape packaging of trays loaded with crystal grains. Background technique [0002] In the integrated circuit manufacturing process, after the integrated circuits on the wafer are manufactured, after testing and cutting the die, they are usually classified according to the test results, and the die of the same grade are removed from the wafer and placed In trays, that is, the grains in each tray are of the same grade. These trays containing the same grade of die will be handed over to the line operator for subsequent inspection and strapping operations. [0003] However, these follow-up inspections and tape packaging operations usually require the online operator to visually inspect each die holding groove in each tray to see if there are die placed upside down, die overturned,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B65B27/08B65B13/18B65B57/06B65B61/00
Inventor 韩信辉赖昌鑫
Owner KING YUAN ELECTRONICS