A strip of a contactless large chip smart card

A large chip and smart card technology, which is applied to recording carriers, instruments, and electrical components used in machines, can solve problems such as poor tensile strength, cumbersome processes, and increased costs, and achieve the effect of maximizing area utilization

CN102819759BActive Publication Date: 2015-09-30周宗涛
5 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Publication Date
2015-09-30

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

The invention discloses a stripe for a non-contact big-chip smart card in the packaging field of a microelectronics semiconductor. The stripe comprises a chip welding chamber, two lead contact pieces and two pouring gate base plates, wherein the chip welding chamber is arranged in the central area of the stripe; the two lead contact pieces are located at two opposite sides of the chip welding chamber; the two pouring gate base plates are located at the two sides of the chip welding chamber; each lead contact piece is provided with an upward bump so that each lead contact piece is a concave-convex solid structure; the two sides of each pouring gate base plate are hollow; and the upward bump is arranged in the middle of the two sides, so each pouring gate base plate is a concave-convex solid structure. The beneficial effects are as follows: after the chip is packaged, a molded body is connected with the lead contact pieces on the stripe in a clampping manner and is also connected with the pouring gate base plates so as to furthest increase the tensile ability between the molded body and the lead contact piece and realize the reliability and feasibility of the non-contact big chip in normal ultrathin single-face molding package with limited package size, so the non-contact big chip can use the area of the chip welding chamber maximally.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The invention relates to the field of microelectronic semiconductor packaging, in particular to a strip of a non-contact large-chip smart card. Background technique

[0002] Contactless smart cards have been widely used in second-generation ID cards, public transportation cards and campus cards. There is a module on the contactless smart card, which is packaged on the strip by single-sided molding process. The total package height of the module is generally below 0.4 mm (0.33 mm is currently used in large quantities, and 0.25 mm is being developed. total package height of the module).

[0003] see figure 1 The strip of the early contactless smart card module includes a chip bonding cavity 3 arranged in the central area of ​​the strip, and the chip 5 is fixed in the chip bonding cavity 3 by fast curing epoxy resin. Lead contact pieces 2 are arranged around the outer periphery of the die bonding cavity 3 . The chip 5 is encapsulated by a molded body ...

Examples

Embodiment Construction

[0025] see Figure 3 to Figure 10 , the inventor of the present invention, in order to better understand the technical solution of the present invention, the following will be described in detail through specific embodiments and in conjunction with the accompanying drawings.

[0026] 1. The first embodiment

[0027] Figure 3 to Figure 6 Shown is a first embodiment of a strip for a contactless large chip smart card of the present invention. In the first embodiment, the strip includes: a chip bonding cavity 3 arranged in the central area of ​​the strip, two lead contact pieces 2 respectively located on opposite sides of the chip bonding cavity 3, and two lead contact pieces 2 respectively located on the chip bonding cavity 3 Weld the sprue bottom plate 7 on both sides of the cavity 3 .

[0028] The two sides 23 of each lead wire contact piece 2 are hollowed out, and the middle of the two sides 23 is an upward protrusion 21, so that the described lead wire contact piece 2 has...