A strip of a contactless large chip smart card

Abstract

The invention discloses a stripe for a non-contact big-chip smart card in the packaging field of a microelectronics semiconductor. The stripe comprises a chip welding chamber, two lead contact pieces and two pouring gate base plates, wherein the chip welding chamber is arranged in the central area of the stripe; the two lead contact pieces are located at two opposite sides of the chip welding chamber; the two pouring gate base plates are located at the two sides of the chip welding chamber; each lead contact piece is provided with an upward bump so that each lead contact piece is a concave-convex solid structure; the two sides of each pouring gate base plate are hollow; and the upward bump is arranged in the middle of the two sides, so each pouring gate base plate is a concave-convex solid structure. The beneficial effects are as follows: after the chip is packaged, a molded body is connected with the lead contact pieces on the stripe in a clampping manner and is also connected with the pouring gate base plates so as to furthest increase the tensile ability between the molded body and the lead contact piece and realize the reliability and feasibility of the non-contact big chip in normal ultrathin single-face molding package with limited package size, so the non-contact big chip can use the area of the chip welding chamber maximally.

Description

technical field [0001] The invention relates to the field of microelectronic semiconductor packaging, in particular to a strip of a non-contact large-chip smart card. Background technique [0002] Contactless smart cards have been widely used in second-generation ID cards, public transportation cards and campus cards. There is a module on the contactless smart card, which is packaged on the strip by single-sided molding process. The total package height of the module is generally below 0.4 mm (0.33 mm is currently used in large quantities, and 0.25 mm is being developed. total package height of the module). [0003] see figure 1 The strip of the early contactless smart card module includes a chip bonding cavity 3 arranged in the central area of ​​the strip, and the chip 5 is fixed in the chip bonding cavity 3 by fast curing epoxy resin. Lead contact pieces 2 are arranged around the outer periphery of the die bonding cavity 3 . The chip 5 is encapsulated by a molded body ...

AI Technical Summary

Problems solved by technology

Because the molds for processing strips are incompatible with each other, the cost increases and the process is cumbersome

Therefore, no breakthrough has been made in the packaging of non-contact large chips.

When the non-contact large chip is packaged in the conventional ultra-thin single-sided molded package with limited package size, because the strip is very thin (the thickness of the metal strip is usually 0.06 to 0.10 mm), and the silver plating layer on the surface of the strip and the The tensile strength between the molded bodies is poor, so the reliability and feasibility of large chips in conventional ultra-thin single-side molded packages of limited package size are constantly being challenged

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