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Epoxy group contained isocyanated acrylate monomer, and preparation method and application thereof

A technology for esterifying acrylates and isocyanates, applied in epoxy resin adhesives, adhesive types, adhesive additives, etc., can solve the problems of low toughening activity, poor peel strength, etc., and achieve excellent performance, low impurity content, The effect of increasing the reactivity

Inactive Publication Date: 2014-06-04
INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the problems of low toughening activity and poor peel strength of existing acrylate oligomers. The present invention provides an application of isocyanated acrylate monomers containing epoxy groups

Method used

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  • Epoxy group contained isocyanated acrylate monomer, and preparation method and application thereof
  • Epoxy group contained isocyanated acrylate monomer, and preparation method and application thereof
  • Epoxy group contained isocyanated acrylate monomer, and preparation method and application thereof

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specific Embodiment approach 1

[0038] Embodiment 1: This embodiment is an isocyanated acrylate monomer containing an epoxy group. The isocyanated acrylate monomer containing an epoxy group is an isocyanated acrylate monomer and bisphenol A epoxy resin. Under the catalysis of the catalyst, the reaction is obtained, wherein the isocyanated acrylate monomer is obtained by the reaction of isocyanate monomer (or isocyanate prepolymer) and hydroxyl-containing acrylate; bisphenol A epoxy resin and isocyanated acrylate The mass ratio of monomers is 100:1.0-10.0, and the molar ratio of isocyanate monomer (or isocyanate prepolymer) to hydroxyl-containing acrylate is 1:1.

[0039] The isocyanated acrylate monomer containing epoxy group in this embodiment can be used as the functional monomer in the acrylate oligomer. Compared with the functional monomer containing epoxy group such as GMA, the ring in the synthesized functional monomer Oxygen is more reactive and can cure at room temperature or lower.

[0040] The bis...

specific Embodiment approach 2

[0044] Embodiment 2: This embodiment is different from Embodiment 1 in that the isocyanate monomer is toluene diisocyanate (TDI), diphenylmethane diisocyanate, hexamethylene diisocyanate or isophorone diisocyanate. Other parameters are the same as in the first embodiment.

specific Embodiment approach 3

[0045] Specific embodiment three: the difference between this embodiment and specific embodiment one or two is that the bisphenol A epoxy resin is a bisphenol A ring with a model number of E-03, E-20, E-44 or E-51 oxygen resin. Other parameters are the same as those in Embodiment 1 or Embodiment 2.

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Abstract

The invention relates to application of an epoxy group contained isocyanated acrylate monomer which solves problems comprising low toughening activity and bad peeling strength of present acrylate oligomers. The inventive epoxy group contained isocyanated acrylate monomer is used as a functional monomer in flexibilizer for epoxy resin adhesive. The epoxy group group isocyanated obtained through reacting an isocyanated acrylate monomer with a bisphenol A epoxy resin under the action of a tin-like catalyst, and the isocyanated acrylate monomer is obtained through reacting an isocyanate monomer or an isocyanate prepolymer. Cured products of modified epoxy resin adhesives toughened by the flexibilizer with the epoxy group contained isocyanated acrylate monomer as the functional monomer have a greatly improved adhesion strength, have a peeling strength of 11.6kN / m at 25DEG C, and have an non-decreasing heat resistance in a certain application amount range, so the adhesives can be used as high-performance structure adhesives for aviation and spaceflight.

Description

technical field [0001] The invention relates to the application of an isocyanated acrylate monomer containing epoxy groups. Background technique [0002] Epoxy resin adhesives have good bonding performance, corrosion resistance, insulation, high strength and other properties, but the biggest disadvantage of untoughened epoxy resin adhesives is that they are brittle after curing and exhibit low 90o peel strength. For structural adhesives, the peel strength is an important indicator to determine whether it can be applied in some occasions. Therefore, the toughening or modification of epoxy resin has become an important research in adhesives based on it or other fields. direction. [0003] For the toughening of paste epoxy resin adhesives, there have been a large number of research reports in recent years, mainly focusing on the toughening modification of bisphenol A epoxy resin, which contains hydroxyl and epoxy groups in its molecules. , so it can be modified by reacting wi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G18/67C08G18/58C08G18/48C09J163/00C09J11/08C08F283/00
Inventor 张绪刚张斌史利利孙明明李坚辉王磊薛刚
Owner INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI