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Urea-formaldehyde adhesive for particleboards and preparation method

An adhesive and particle board technology, applied in the direction of adhesives, aldehyde/ketone condensation polymer adhesives, adhesive types, etc., can solve the problems of high consumption of melamine, high price and high cost, and achieve precise and easy-to-master endpoint control. Effect

Active Publication Date: 2014-04-16
GUANGXI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] Although the above-mentioned various urea-formaldehyde glue modification methods can make E 0 / E 1 Grade particleboard, but most of them do not have moisture-proof performance, and some melamine dosage is too high
And phenolic resin, melamine resin or isocyanate are too expensive, resulting in high cost

Method used

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  • Urea-formaldehyde adhesive for particleboards and preparation method
  • Urea-formaldehyde adhesive for particleboards and preparation method
  • Urea-formaldehyde adhesive for particleboards and preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] 1. Formula:

[0038] The molar ratio of formaldehyde to urea is F / U=1.20, 550 parts of formaldehyde (concentration 37%), 346 parts of urea (purity 98%), and 67 parts of melamine.

[0039] 2. Preparation process:

[0040] 1) Put 480 parts of formaldehyde aqueous solution into the reaction kettle, start the agitator, heat up and heat up, and stop heating when the temperature rises to 40°C. , adjust the pH value to 7.5-8.0 with 25-30% aqueous sodium hydroxide solution.

[0041] 2) Add 165 parts of the first batch of urea, stop heating when the temperature rises to 70°C, and then naturally raise the temperature to 90°C. Detect pH (guarantee pH = 6.5-7.0) add 15 parts after incubating for 10 minutes, and stir for 15 minutes.

[0042] 3) Use 25-30% formic acid aqueous solution to adjust the pH between 4.8-5.2, and the temperature is 83±2°C, let it undergo polycondensation reaction (drop the reactant into 40-45°C water, the white cloud is the first end point) .

[0043] 4...

Embodiment 2

[0057] 1. Formula:

[0058] The molar ratio of formaldehyde to urea is F / U=1.22, 550 parts of formaldehyde (concentration 37%), 340 parts of urea (purity 98%), and 62 parts of melamine.

[0059] 2. Preparation process:

[0060] 1) Put 480 parts of formaldehyde aqueous solution into the reaction kettle, start the agitator, start heating and heating, and stop heating when the temperature reaches 40°C. , adjust the pH value to 7.5-8.0 with 25-30% aqueous sodium hydroxide solution.

[0061] 2) Add 165 parts of the first batch of urea, stop heating when the temperature rises to 70°C, and then naturally raise the temperature to 90°C. After detecting the pH (guaranteed pH=6.5-7.0) and incubating for 10 minutes, add 13 parts of melamine and stir for 15 minutes.

[0062] 3) Use 25-30% formic acid aqueous solution to adjust the pH between 5.0-5.3, the temperature is 83±2°C, let it undergo polycondensation reaction (drop the reactant into 40-45°C water, the white cloud is the first en...

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Abstract

The invention relates to a urea-formaldehyde resin adhesive for particleboards. The adhesive mainly includes the following raw materials by mass part: 60-66 parts of formaldehyde, 33-26 parts of urea, and 6.5-8.0 parts of melamine. In the invention, the traditional one-time feeding is replaced by two-time feeding of formaldehyde. During the first formaldehyde feeding, urea and melamine are added in order to generate melamine modified urea-formaldehyde resin (MUF). During the second formaldehyde feeding, melamine is then added, and urea is not added so as to generate melamine formaldehyde resin (MF). In the reaction process, three-time terminal control is employed to replace the traditional one-time terminal control, and the urea is fed in four times instead of traditional three times. The technical scheme provided in the invention can promote the organic combination of MUF and MF resin, and can achieve a better effect than mechanical mixing use, so that less melamine can play a greater role.

Description

technical field [0001] The invention relates to an adhesive for particleboard, in particular to a moisture-proof E 0 / E 1 Grade urea-formaldehyde resin adhesive. [0002] The present invention also relates to a method for preparing the above-mentioned adhesive. Background technique [0003] In recent years, my country has become the world's largest producer of wood-based panels, but although the output is large, there are not many varieties, especially the functional varieties. As far as particleboard is concerned, most factories only produce particleboard for furniture and interior decoration used under dry conditions, which cannot meet the requirements of the development of the situation. According to actual needs, the new national standard GB / T 4897-2003 for particleboard adds requirements for structural boards used in wet conditions and reinforced structural boards used in wet conditions. It is stipulated that the particleboard used in the wet state not only raises t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J161/30C08G12/38
Inventor 刘幽燕张运明
Owner GUANGXI UNIV