One-step press forming process and manufacturing method of CPU (Central Processing Unit) back board

A technology of stamping forming and process method, which is applied in the field of thinning and forming with only one stamping, and can solve the problems of high processing time and cost, and expensive processing methods.

Inactive Publication Date: 2013-01-02
INVENTEC CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, for the above methods of manufacturing different thicknesses, the milling processing method is more expensive; the stamping and edge trimming procedures require multiple processes, which makes the processing time and cost high; and the pla

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  • One-step press forming process and manufacturing method of CPU (Central Processing Unit) back board
  • One-step press forming process and manufacturing method of CPU (Central Processing Unit) back board
  • One-step press forming process and manufacturing method of CPU (Central Processing Unit) back board

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Embodiment Construction

[0036] In order to enable your review committee members to have a further understanding and understanding of the features, purposes and functions of the present invention, the relevant detailed structure and design concept of the system of the present invention will be explained below, so that the review committee members can understand the present invention The characteristics are described in detail as follows:

[0037] figure 2 It is a schematic flow chart of the one-time stamping process of the present invention. The present invention provides a process 1 for one-time stamping forming, which is a method for producing different thicknesses at one time on the same material. The process 1 for one-time stamping and forming comprises the following steps: Step 10 is to measure the material to be punched. The original thickness and area of ​​the thinned part to obtain the original volume of the material to be thinned; step 11 is to calculate the thickness and area required for ...

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Abstract

The invention provides a one-step press forming process and a manufacturing method of a CPU (Central Processing Unit) back board. The one-step press forming process is a method which makes different thicknesses by a same material for one step, and comprises the following steps of: measuring the original thickness and area of a to-be-thinned part of the material so as to obtain the original volume of the to-be-thinned part of the material; calculating the thickness and area of the to-be-thinned part of the material after treatment so as to obtain the volume of the to-be-thinned part of the material after treatment; subtracting the volume of the to-be-thinned part of the material after treatment from the original volume of the to-be-thinned part of the material so as to obtain a to-be-removed volume; and removing the to-be-removed volume from the to-be-thinned part of the material; and pressing the to-be-thinned part of the material. The one-step press forming process provided by the invention has the advantages of simplifying a process and saving cost.

Description

technical field [0001] The invention relates to a stamping forming process, in particular to a process for thinning and forming with only one stamping. Background technique [0002] Generally, if you want to process on the same plate, so that the same plate has different thicknesses, and the area of ​​the thinner part of the plate is limited, you can usually use milling to thin the thickness, or repeat it many times. Stamping and trimming procedures to change the thickness of the sheet. The latter is to use the stamping process to thin the part where the plate is to be thinned, so that the thickness is reduced. In addition, the edge trimming process is used to make the area of ​​the thinner part of the plate not exceed the limited size. The existing method is through repeated stamping. And trimming, so that the specifications of the thinner part of the plate gradually meet the requirements. [0003] Or, use the method of joining plates of different thicknesses together to ...

Claims

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Application Information

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IPC IPC(8): B21D35/00B21D22/02B21D31/02
Inventor 刘泰舜叶云杰吕昆达
Owner INVENTEC CORP
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