Tool capable of improving yield for slicing silicon rod

Abstract

The invention relates to a tool capable of improving yield for slicing a silicon rod. The tool comprises a bottom plate for placement of the silicon rod and a support plate which is vertical to the bottom plate, wherein an epoxy resin adhesion layer is adhered to the surface of the bottom plate, the support plate is provided with a pair of clamping mechanisms which are a left clamping mechanism and a right clamping mechanism for clamping the ends of the silicon rod, the left clamping mechanism comprises a left guide rod, a left spring and a left splint which is connected with the left spring, the left spring and the left splint are sleeved on the left guide rod, the right clamping mechanism comprises a right guide rod, a right spring and a right splint which is connected with the right spring, the right spring and the right splint are sleeved on the right guide rod, and the right splint slides on the right guide rod through the right spring. According to the tool capable of improving yield for slicing the silicon rod provided by the invention, by adopting the left and right splints and the support plate to clamp and position the ends of the silicon rod, the phenomenon of avoiding displacement in the cutting process of the silicon rod can be effectively improved, thus improving the slicing quality and the working efficiency.

Description

technical field [0001] The invention relates to the field of silicon rod slicing, in particular to a tool for silicon rod slicing with improved yield. Background technique [0002] Solar silicon wafer cutting is a key part of the solar photovoltaic cell manufacturing process. The quality of the cut silicon wafers is closely related to the economic benefits of the companies that manufacture the silicon wafers. Most of the cutting methods currently used are parallel wire mesh cutting methods. Place the silicon rods on a horizontal glass plate, then glue the glass plate on the metal bottom plate of the cutting bracket, and then turn the bracket upside down after the bonding is firm, so that the silicon rods are at the bottom and the metal plate is at the top. In order to cut, because during the cutting process, the steel wire mesh will exert a pressure on the silicon rod when it falls on the silicon rod. Since the silicon rod is simply bonded to the glass plate through an adhes...

AI Technical Summary

Problems solved by technology

[0002] Solar silicon wafer cutting is a key part of the solar photovoltaic cell manufacturing process. The quality of the cut silicon wafers is closely related to the economic benefits of the companies that manufacture the silicon wafers. Most of the cutting methods currently used are parallel wire mesh cutting methods. Place the silicon rods on a horizontal glass plate, then glue the glass plate on the metal bottom plate of the cutting bracket, and then turn the bracket upside down after the bonding is firm, so that the silicon rods are at the bottom and the metal plate is at the top. In order to cut, because during the cutting process, the steel wire mesh will exert a pressure on the silicon rod when it falls on the silicon rod. Since the silicon rod is simply bonded to the glass plate through an adhesive, the high-speed steel wire When the wire mesh cuts the silicon rod, it is easy to cause chipping and displacement of the silicon rod, which seriously affects the quality of the slice

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