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Room temperature cured high-temperature resistant epoxy adhesive

An epoxy adhesive, room temperature curing technology, applied in the direction of adhesives, epoxy resin glue, non-polymer adhesive additives, etc., can solve the problems of epoxy adhesive limitations and other issues

Active Publication Date: 2015-05-13
SHANGHAI PLASTICS RES INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, most heat-resistant epoxy adhesives need to be heated during the curing process, which limits the application of epoxy adhesives in many fields. The key to the problem is to make heat-resistant epoxy adhesives cure at room temperature

Method used

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  • Room temperature cured high-temperature resistant epoxy adhesive
  • Room temperature cured high-temperature resistant epoxy adhesive
  • Room temperature cured high-temperature resistant epoxy adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] Room temperature curing high temperature resistant epoxy adhesive is a two-component epoxy adhesive composed of a resin component and a curing agent component. When used, the weight ratio between the resin component and the curing agent component is 100:47.64; 100 parts by weight of carboxyl-terminated liquid nitrile rubber modified Ande AG-80 and 25 parts by weight of bisphenol A diglycidyl ether compound; carboxyl-terminated liquid nitrile rubber modified Ande AG-80 is composed of 20 parts by weight of carboxyl-terminated nitrile rubber and 80 parts by weight of An Debao -80, using triphenylphosphine as a catalyst, pre-esterified at 125-135°C for 0.5-1 hour to form a block copolymer with epoxy group chain unit at both ends.

[0051] The curing agent component consists of 5.8 parts by weight of JH-5200 modified aromatic amine, 18 parts by weight of polyamide, 15.2 parts by weight of 4,4-diaminodiphenylmethane, 2.3 parts by weight of 2-ethyl-4-methyl It is prepared...

Embodiment 2

[0058] Room temperature curing high temperature resistant epoxy adhesive is a two-component epoxy adhesive composed of a resin component and a curing agent component. The weight ratio between the resin component and the curing agent component is 100:50.2 when used;

[0059] Its resin component consists of 100 parts by weight of carboxyl-terminated liquid nitrile rubber modified tetraglycidylamine type epoxy resin and AG-70 and 25 parts by weight of bisphenol A diglycidyl ether are compounded; carboxyl-terminated liquid nitrile rubber modified tetraglycidylamine type epoxy resin is made of 20 parts by weight of carboxyl-terminated nitrile rubber and 80 parts by weight tetraglycidylamine polyfunctional epoxy resin AG-70 is prepared by using triphenylphosphine as a catalyst and pre-esterifying at 125-135°C for 0.5-1 hour to form a block copolymer with epoxy group chain units at both ends.

[0060] The curing agent component consists of 6.2 parts by weight of JH-5200 modified a...

Embodiment 3

[0064] Room temperature curing high temperature resistant epoxy adhesive is a two-component epoxy adhesive composed of resin component and curing agent component. The weight ratio between resin component and curing agent component is 100:52 when used.

[0065] Its resin component is compounded by 100 parts by weight of carboxyl-terminated liquid nitrile rubber modified tetraglycidylamine epoxy resin and 25 parts by weight of bisphenol A diglycidyl ether; carboxyl-terminated liquid nitrile rubber modified Tetraglycidylamine type epoxy resin is made of 20 parts by weight of carboxyl-terminated nitrile rubber, 40 parts by weight of AG-80, and 40 parts by weight of AG-70, using triphenylphosphine as a catalyst, pre-prepared at 125 to 135 ° C. After 0.5-1 hour of esterification reaction, a block copolymer with epoxy group chain unit at both ends is formed.

[0066] The curing agent component consists of 6.5 parts by weight of JH-5200 modified aromatic amine, 20 parts by weight of p...

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Abstract

The invention discloses room temperature cured high-temperature resistant epoxy adhesive. The adhesive is double-component epoxy adhesive composed of resin component and curing agent component, with a weight ratio of 100:(45-60) when in use. The resin component is composed of carboxyl-terminated liquid nitrile-butadiene rubber modified tetraglycidylamine epoxy resin 100-120 weight parts and bisphenol A diglycidyl ether 25-40 weight parts; and the curing agent is prepared from (by wt%) modified amine 5.8-7.2, polyamide 18-25, 4,4-diaminodiphenylmethane 15.2-16.5, imidazole 2.3-4.8, tertiary amine catalyst 0.75-1.5, filling 16-40, and inorganic filling 1.5-3.5. The invention has curing temperature of room temperature, and shearing strength reaching 4.5 MPa at 200 DEG C.

Description

technical field [0001] The invention relates to the technical field of epoxy adhesives, in particular to a room temperature curing high temperature resistant epoxy adhesive. Background technique [0002] In recent years, the rapid development of high-tech industries such as aerospace, aircraft manufacturing, precision electronics and machining has put forward higher requirements for the heat resistance of adhesives, such as the honeycomb structure of supersonic aircraft wings, the friction between the outside of the wing and the air It can heat up to more than 260°C. The printed circuit control boards in the engines of some fighter jets require a service temperature of 280°C, and many spacecraft components such as wire connectors, wire sheaths, etc. also require heat-resistant adhesives. However, most heat-resistant epoxy adhesives need to be heated during the curing process, which limits the application of epoxy adhesives in many fields. The key to the problem is to make h...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J163/02C09J11/04
Inventor 孙军崔立波
Owner SHANGHAI PLASTICS RES INST CO LTD
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