Solder paste thickness measuring bracket

A technology for thickness measurement and solder paste, which is applied in the field of solder paste thickness measurement brackets, can solve problems such as the inability to accurately measure the thickness of solder paste, achieve the effects of simple structure, convenient use, and improved thickness measurement accuracy

Inactive Publication Date: 2013-01-02
SHANGHAI CHENXING ELECTRONICS SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a solder paste thickness measuring bracket in order to overcome the defect that the platform of the solder paste thickness gauge in the prior art cannot accurately measure the thickness of the solder paste on both sides of the printed circuit board

Method used

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  • Solder paste thickness measuring bracket

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Such as figure 1 As shown, the solder paste thickness measuring bracket of the present invention includes two slide rails 1 , and a baffle plate 2 as a limiting component is respectively fixed at the ends of the slide rails 1 . Two clamping parts 3 parallel to each other are slidably arranged on the slide rail 1 , and a recess 31 is provided on opposite sides of the two clamping parts 3 for supporting the object to be measured. The above-mentioned baffle plate 2 can effectively prevent the clamping part 3 from slipping out of the slide rail 1 during the sliding process.

[0020] A bolt 4 as a locking element is also arranged on the clamping part 3 , the bolt 4 passes through the above-mentioned clamping part 3 vertically, and the bottom of the bolt 4 is located above the slide rail 1 . When the bolt 4 is tightened downwards, the bottom is tightly pressed against the slide rail 1 , thereby fixing the clamping part 3 and the slide rail 1 .

Embodiment 2

[0022] in such as figure 1 As shown, the difference between this embodiment and Embodiment 1 is that the solder paste thickness measuring bracket in this embodiment further includes four springs 5 ​​as elastic components. The four springs 5 ​​are all worn on the slide rail 1, and are separated between the baffle plate 2 and the clamping part 3 on the same side, and the two ends of the same spring 5 are respectively pressed against the baffle plate 2 and the clamping part 3 on. When the object to be measured is clamped between the two clamping parts 3, the springs 5 ​​are both compressed, and the restoring force of the springs on both sides tends to bring the two clamping parts 3 closer to each other so as to clamp the object to be measured.

[0023] The elastic component and the locking piece of the solder paste thickness measuring bracket exist at the same time, which can achieve the purpose of further fixing the clamping component 3 . Of course, the locking piece or the el...

Embodiment 3

[0025] Another example figure 1 As shown, the difference between this embodiment and Embodiment 2 is that the spring 5' in this embodiment is arranged between the two clamping parts 3 to replace the spring 5 in Embodiment 2. When the object to be measured is clamped between the two clamping parts 3, the spring 5' is stretched, and the restoring force of the spring 5' tends to bring the two clamping parts 3 closer to each other so as to clamp the object to be measured. The remaining parts are exactly the same as those in Embodiment 2, and will not be repeated here.

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Abstract

The invention discloses a solder paste thickness measuring bracket which comprises at least a sliding rail, wherein two mutually parallel clamping components are slipperily arranged on the sliding rail, and each clamping component is provided with a locking component. The solder paste thickness measuring bracket disclosed by the invention is simple in structure and convenient to use, and can ensure that a double-sided printed circuit board always keeps in a horizontal state in two thickness measuring processes, thereby preventing the double-sided printed circuit board from being affected by a surface mounted component and then improving the thickness measuring accuracy.

Description

technical field [0001] The invention relates to a supporting device, in particular to a solder paste thickness measuring bracket. Background technique [0002] At present, the requirements for electronic components, ICs, and BGAs in the electronics industry are becoming more and more sophisticated, and the requirements for printing quality are also increasing accordingly. Therefore, the height measurement of the solder paste must be accurate. At present, when making double-sided boards, since the solder paste thickness gauge is a platform, when testing the thickness of the solder paste on the second side, because the bottom of the PCB board has been pasted with components, it cannot be used on the platform. Keeping it steady will lead to inaccurate solder paste thickness test data. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a solder paste thickness measuring bracket in order to overcome the defect that the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B21/08
Inventor 蔡红星
Owner SHANGHAI CHENXING ELECTRONICS SCI & TECH CO LTD
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