Display panel and display panel manufacturing method

Abstract

The present invention provides a display panel and a display panel manufacturing method. The display panel is provided with an element substrate including a first concave part in a pixel region with a light-emitting element, a second concave part in a region corresponding to the pixel region, and a first convex part between the first recessed part and the second recessed part; an opposite substrate provided with a second convex part in a region corresponding to the pixel region, a third concave part in a region corresponding to the pixel region, and a recessed zone of the third concave part disposed in a region opposite to the first convex part in an extending way, the height of the protruding zone of the second convex part is larger than the depth of the recessed zone of the first concave part, when the gap between the first concave part and the second convex part is defined to be D1, the gap between the first convex part and the recessed zone of the third concave part opposite to the first convex part is defined to be D2, and the gap between the second concave part and the third concave part is defined to be D3, the relationship that the gap D1<the gap D2<D3 is satisfied; and the display panel is provided with a sealing resin layer disposed between the element substrate and the opposite substrate.

Description

technical field [0001] The present invention relates to a display panel in which a sealing resin layer is interposed between an element substrate and a counter substrate. Background technique [0002] Conventionally, a sealing resin layer has been provided in order to prevent light-emitting elements such as organic EL elements from deteriorating due to infiltration of moisture and / or oxygen from the outside. That is, a sealing resin layer is formed between the element substrate on which the light-emitting element is formed and the counter substrate (for example, a CF substrate) facing it. [0003] Hereinafter, a method of forming the sealing resin layer will be described. [0004] Figure 24 is a schematic diagram showing the flow of resin during molding of the sealing resin layer, Figure 25 yes Figure 24 A magnified view of part A of the Figure 26 yes Figure 24 Sectional view of B1-B2. Figure 27 It is a schematic diagram showing the diffusion (spread) of the resin ...

AI Technical Summary

Problems solved by technology

In the case where the void 905 exists on the light emitting element, there is a problem that since the light emitting element is not covered with the sealing resin layer, the light emitting element cannot be protected from deterioration caused by moisture and / or oxygen intruding from the outside.

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