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Biaxial drive mechanism, die bonder and die bonder operating method

A dual-axis drive and bonder technology, which is applied in the manufacture of electric solid devices, semiconductor devices, semiconductor/solid state devices, etc., can solve problems such as damage and bond head damage

Active Publication Date: 2013-01-16
FASFORD TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If only the linear motor is used for driving, when the lifting shaft is simply moved manually when the power is lost, such as Figure 4 As shown in (b), depending on the situation, there is a possibility that the bonding head as the processing part may fall on the substrate (processing target) such as a lead frame, the bonding head may be damaged, and the substrate, that is, the product may also be damaged.

Method used

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  • Biaxial drive mechanism, die bonder and die bonder operating method
  • Biaxial drive mechanism, die bonder and die bonder operating method
  • Biaxial drive mechanism, die bonder and die bonder operating method

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Experimental program
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Embodiment Construction

[0035] Embodiments of the present invention will be described below with reference to the drawings.

[0036] figure 1 It is a conceptual diagram which looked at the die bonder 10 which is 1st Embodiment of this invention from above. The die bonder generally has a wafer supply unit 1, a workpiece supply and transfer unit 2, a die bonder unit 3, a power supply unit 9, and a control unit 7 for controlling these components.

[0037] The wafer supply unit 1 has a cassette elevator 11 and a pickup device 12 . The cassette elevator 11 has a cassette (not shown) filled with wafer rings, and sequentially supplies the wafer rings to the pickup device 12 . The picker 12 moves the wafer ring so that a desired die can be picked up from the wafer ring.

[0038] The workpiece supply and conveyance unit 2 has a stacker 21, a frame feeder 22, and an unloader 23, and conveys workpieces (substrates such as lead frames) in the direction of the arrow. The stacker 21 supplies the workpieces to...

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PUM

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Abstract

A highly reliable biaxial drive mechanism and a die bonder operating method capable of preventing fall of an elevation axis of a linear motor upon loss of power are disclosed. The biaxial drive mechanism includes a handling part; a biaxial drive axes provided with a first linear motor unit having a first movable part that moves up and down the handling part along a first linear guide and a first stationary part, and a second linear motor unit having a second movable part that moves the handling part in a horizontal direction vertical to a direction of up and down movement and a second stationary part; a main power source that supplies a power source to the biaxial drive axes; and an elevation axis fall prevention unit that prevents fall of a handling part upon loss of power at the main power source.

Description

technical field [0001] The present invention relates to a biaxial driving mechanism including a lifting shaft, a die bonder using the biaxial driving mechanism and a method for operating the die bonding device, in particular to a biaxial driving mechanism including a highly reliable lifting shaft and using the biaxial driving mechanism. A die bonder with high reliability of a shaft drive mechanism and a method for operating the die bonder. Background technique [0002] One type of semiconductor manufacturing apparatus includes a die bonder for bonding a semiconductor chip (die) to a substrate such as a lead frame. In the die bonder, the die is vacuum-adsorbed by the bonding head, raised at high speed, moved horizontally, lowered, and mounted on the substrate. In this case, it is the lift (Z) drive shaft that moves up and down. [0003] Currently, there is an increasing demand for high precision and high speed of the die bonder, and especially high speed of the bonding head...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/58
CPCH01L2224/75745H01L24/83H01L2224/75611H01L21/67144H01L2224/83192H01L2224/27312H01L24/75Y10T156/10Y10T156/17H01L21/67132H01L21/67721H01L21/6838
Inventor 深泽信吾保坂浩二
Owner FASFORD TECH