Processing method of through holes of printed circuit board (PCB) and through hole structure

Abstract

The invention discloses a processing method of through holes of a printed circuit board (PCB) and a through hole structure. The method and the structure aim at resolving the problem in the existing scheme that high speed signal quality in the PCB is affected by larger parasitic capacitance generated in the through holes after press connection devices are pressed mutually in the through holes of the PCB. By means of the method, the through hole structure of the PCB is modified and is processed into a 'dumbbell'-shaped structure. Therefore, the generated parasitic capacitance is very small after the press connection devices are mutually pressed on the PCB due to the fact that vacancy hole diameter between press connection pins is much smaller than that of the through holes in the existing scheme, and signal quality of the PCB is improved. The processing method of the 'dumbbell'-shaped through hole structure is further provided.

Description

technical field [0001] The invention relates to the technical field of communications, in particular to a PCB through-hole processing method and a through-hole structure for improving signal quality. Background technique [0002] As the signal rate of a single-layer PCB board becomes higher and higher, parasitic capacitance will be generated when the signal passes through the metal vias formed on the PCB board. Moreover, the larger the diameter of the metal via, the larger the generated parasitic capacitance. For high-speed signals, the existence of parasitic capacitance will delay the rising edge time of the signal. If the situation is relatively bad, it will cause serious crosstalk and signal transmission cannot continue. [0003] The technology of electrically connecting electronic components and PCB boards by crimping is becoming more and more widely used. It is mainly to design crimping pins that can be deformed by force on the device. When the crimping pins are press...

AI Technical Summary

Problems solved by technology

[0004] like figure 1 As shown in the figure, after the connector is pressed against both sides on the PCB, the diameter of the vacant metal aperture between the crimped pins is consistent from top to bottom, which is relatively large. In the actual application process, a large parasitic capacitance will be generated, which will affect the high-speed signal. quality

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