Protection process for inner layer welding point of soft and hard combined plate

Abstract

The invention provides a protection process for an inner layer welding point of a soft and hard combined plate. The protection process comprises the following steps of: 1, supplying a soft and hard combined thin plate, wherein the soft and hard combined thin plate has an inner layer welding point structure; 2, performing silk screening on a circuit board at the inner layer welding point structure of the soft and hard combined thin plate by ink; 3, supplying a plurality of copper foils and a plurality of prepregs; 4, setting laminated positions between the copper foils, the prepregs and the soft and hard combined thin plate according to a requirement of the finished soft and hard combined plate, and laminating; 5, performing film drying process according to the requirement of the finished soft and hard combined plate; 6, performing etching process; and 7, eliminating the ink, and exposing an inner layer circuit board. By the protection process for the inner layer welding point of the soft and hard combined plate, the circuit board at the inner layer welding point is prevented from being corroded during etching; the flow of the process is simple; the circuit board at the inner layer welding point can be well protected from being corroded; and the quality of the soft and hard combined plate is guaranteed.

Description

technical field [0001] The invention relates to the field of rigid-flex boards, in particular to a protection process for an inner circuit board of a rigid-flex board. Background technique [0002] Industry, medical equipment, 3G mobile phones, LCD TVs and other consumer electronics such as: hard drives for electronic computers, floppy disk drives, mobile phones, notebook computers, cameras, camcorders, PDAs and other portable electronic products The market demand continues to expand. Devices are becoming more and more light, thin, short, small and multi-functional. In particular, the application of flexible boards for high-density interconnection structures (HDI) will greatly drive the rapid development of flexible printed circuit technology. PCB) has been developed and researched and has been widely used. It is expected that the global supply of soft and hard boards will increase significantly in the future. At the same time, the durability and flexibility of rigid-flex ...

AI Technical Summary

Problems solved by technology

[0003] However, the traditional uncapping process of the existing soft-hard combination board mainly includes MILL board (cold-rolled board), gasket, blade cutting, etc., but for the inner layer exposed welding point (PAD) and the completed board thickness is less than 0.4mm Rigid-flex boards are prone to hidden quality hazards such as inner PAD being eroded when the cover is opened

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