Device and method for detecting micro-electronic packaging process quality based on photo-thermal imaging

Abstract

An image acquisition device based on photo-thermal imaging, including a support beam, a translational electric motor, an imaging probe, and a light emitter. The translational electric motor is fixed to the lower side of the beam, and the imaging probe is perpendicularly fixed to a moving block in the translational electric motor. The light emitter is connected to the moving block via an adjustable connection piece, and by adjusting the adjustable connection piece, light emitted by the light emitter enters the imaging probe after being reflected by a sample. The moving block in the translational electric motor is configured to move the light emitter and the imaging probe in the radial direction right above the sample. The light emitter is configured to emit light on the upper surface of the sample. The imaging probe is configured to image reflected light from the upper surface of the sample.

Description

technical field [0001] The invention belongs to the field of microelectronic packaging, and more specifically relates to a photothermal imaging-based microelectronic packaging process quality detection device and method. Background technique [0002] Three-dimensional microelectronic packaging technology, that is, three-dimensional electronic packaging technology, is a higher-density electronic packaging that is further developed into space on the basis of two-dimensional planar electronic packaging. This technology can make the corresponding electronic system more functional, better in performance, and reliable. Higher reliability and lower cost. Among them, through-silicon via technology, as a new technology solution for interconnection of stacked chips in three-dimensional integrated circuits, has the following significant advantages: the stacking density of chips in the three-dimensional direction is the largest, the interconnection lines between chips are the shortest, ...

AI Technical Summary

Problems solved by technology

[0003] However, limited by the constraints of feature size, micropore aspect ratio, etc., there are still many process problems to be solved in many TSV technology routes.

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