A Method and Device for Evaluation of Friction Scale Effect in Plastic Micro-volume Forming
A scale effect and evaluation device technology, which is applied to measuring devices, mechanical devices, instruments, etc., can solve the problems of uniform lubricant application and storage difficulties, and achieve the effects of large expansion rate, solving test problems, and accurate testing
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specific Embodiment approach 1
[0024] Specific implementation mode one: as Figure 1~2 As shown, a method for evaluating the scale effect of friction in plastic micro-volume forming described in this embodiment is realized according to the following steps:
[0025] Step 1. The T-shaped micro-upsetting experiment method is used to carry out the plastic micro-volume forming (micro-forming) experiment. The experiment is based on the micro-punch 1, the cylindrical sample 2 (cylindrical blank) and the V-shaped groove die 3 to achieve;
[0026] During the T-shaped micro-upsetting experiment, the cylindrical sample 2 is deformed under the action of the micro punch 1, and is filled into the V-shaped groove of the V-shaped groove die 3, so that the cross-sectional shape of the formed part is T shape;
[0027] Step 2. The load of the micro-punch is linearly related to the friction force during the filling process, and the slope of the punch load-punch displacement curve is used to represent the friction coefficient...
specific Embodiment approach 2
[0033] Specific implementation mode two: as Figure 3-9 As shown in this embodiment, a plastic micro volume forming friction scale effect evaluation device for implementing the evaluation method described in Embodiment 1, the device includes an upper layer I, a middle layer II, a lower layer III, a micro punch 1 and a V Type groove die 3; The upper layer I is composed of an upper template 6, an upper backing plate 7 and a punch fixing plate 8 arranged from top to bottom, and the upper layer I is positioned by a pin and connected by a screw; The middle layer II is composed of an intermediate backing plate 9, a clamping plate 10 and a heating ring 16. The intermediate backing plate 9 is located above the clamping plate 10, and the heating ring 16 is installed in the center hole on the clamping plate 10; the lower layer III is fixed by a die plate 11 It is composed of the lower mold base 12, and the die fixing plate 11 is located above the lower mold base 12; the upper layer I, t...
specific Embodiment approach 3
[0034] Specific implementation mode three: as Figure 3-9 As shown, in this embodiment, the clamping plate 10 in the middle layer II and the die fixing plate 11 in the lower layer III are each equipped with four guide sleeves 4 . Other components and connections are the same as those in the second embodiment.
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