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Adhesion Enhancement for Flexible Circuit Cover Films

A flexible circuit and cover film technology, which is applied in printed circuit, printed circuit, printed circuit manufacturing, etc., can solve problems such as circuit short circuit, weak signal, printing machine pen not working, etc.

Active Publication Date: 2016-08-24
3M INNOVATIVE PROPERTIES CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This can cause a short circuit and a weak signal which can render the printer pen inoperable

Method used

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  • Adhesion Enhancement for Flexible Circuit Cover Films
  • Adhesion Enhancement for Flexible Circuit Cover Films
  • Adhesion Enhancement for Flexible Circuit Cover Films

Examples

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example

[0035] The following examples illustrate this invention, but the particular materials and amounts recited in these examples, as well as other conditions and details, should not be construed to unduly limit this invention.

[0036] To demonstrate at least one aspect of the present invention, UPILEX VT film (15um thick) was purchased from UBE-Nitto Kesai Co. Ltd., Japan, to be used as a cover film and coated with ELEPHANE CL -X adhesive (commercially available from Tomoegawa, Japan) to form the cover layer. The overlay is subjected to an encapsulant adhesion test on the overlay film side as follows:

[0037] A drop of 3M Epoxy 1735 encapsulant was applied to approximately 1 mm of the exposed surface of the UPILEX VT film, and the overlay was cured in an oven at 130°C for 30 minutes. Comparative Examples were processed in the same manner, but with UPILEX SN and UPILEX CA instead of UPILEX VT as cover films.

[0038] Prepared samples (including comparative examples) were first s...

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Abstract

The present invention provides a method of improving adhesion between a flexible circuit cover film and an encapsulating material in inkjet printer applications.

Description

[0001] Cross References to Related Patent Applications [0002] This patent application claims U.S. Provisional Patent Application Nos. 61 / 346538, filed May 20, 2010, 61 / 389771, filed October 5, 2010, and U.S. Provisional Patent Application No. 61 / 434,689, filed January 20, 2011 rights and interests. technical field [0003] The present invention relates to improving adhesion between flexible circuit coverfilms and encapsulating materials in inkjet printer applications. Background technique [0004] In a variety of applications, flex circuits may be exposed to corrosive materials. In these applications, it is desirable to protect the flexible circuit with a protective cover or cover. One such application is an inkjet printer pen. [0005] An inkjet printer pen is an ink cartridge installed in an inkjet printing system to store and dispense ink onto a recording medium (eg, paper). An inkjet printer pen generally includes a pen body for holding ink, a printer chip dispose...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/34H05K3/38B31B50/62
CPCB29C59/04H05K1/189H05K3/28H05K2201/0397H05K2201/10674H05K2201/10977H05K2203/0108H05K2203/0143H05K2203/1152Y10T156/10H05K3/34H05K3/38
Inventor 拉维·帕拉尼斯瓦米陈风良罗纳德·L·伊姆肯罗宾·E·戈雷尔
Owner 3M INNOVATIVE PROPERTIES CO