Fixed length conveying device for integrated chip lead frame

Abstract

The invention discloses a fixed length conveying device for an integrated chip lead frame. The device comprises a base and a controller; leveling, guiding, transmission, clamping and detecting mechanisms are arranged on the base; the leveling mechanism consists of at least three parallel leveling rollers staggered on the upper and lower layers, and the center of the upper leveling roller is adjustable; the guiding mechanism is formed by connecting two parallel guiding plates with a guide rail; the transmission mechanism consists of a linear cylinder, and a slide rail of the linear cylinder is connected with front and rear step pitch adjusting blocks at the front and rear ends of a cylinder body; the clamping mechanism consists of a clamp hinged on a cylinder body of the linear cylinder and an opening and closing cylinder fixed on the cylinder body, a clamping block is arranged on each of an upper jaw and a lower jaw of the clamp, the middle part of an upper clamp rod of the clamp is hinged with a piston rod of the opening and closing cylinder, and a lower clamp rod is fixedly connected with the cylinder body; and the detecting mechanism comprises a pedestal fixed on the base, and front and rear position sensors arranged on the pedestal and having adjustable positions. The device continuously realizes leveling and cutting and direct measurement and is convenient to adjust, and workpieces are flat.

Description

technical field [0001] The invention belongs to the technical field of electronic chip packaging equipment, and in particular relates to a fixed-length transmission device for an integrated chip lead frame. Background technique [0002] Before the integrated chip is packaged, the integrated chip lead frame needs to be silver-plated. Because the integrated chip lead frame has a small plating area and a large batch, it is necessary to adopt an assembly line operation, that is, a large number of integrated chip lead frames are plated in the form of a coil, and then Then the coil material is unloaded and cut to obtain a single finished product. Due to the high flatness and surface quality requirements of the integrated chip lead frame, it is necessary to cut immediately after the integrated chip lead frame coil is leveled to avoid new deformation and surface damage during the transfer process. Different from the cutting of soft film or rigid steel plate, especially the transmis...

AI Technical Summary

Problems solved by technology

This tape transmission method uses soft tapes to be wound on the main and driven rollers, which is obviously not suitable for the transmission of integrated chip lead frames that require strict flatness; moreover, this solution does not need to level soft sheets such as film, If it is to level the steel plate, you only need to set the leveling mechanism independently; thirdly, the measurement of the length of the plate in this scheme is determined by inferring the number of pulses sent by the stepper motor. The accumulation of errors in many links makes the results unreliable

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