Semiconductor bridge energy conversion chip for electro-explosive device

Abstract

The invention discloses a semiconductor bridge energy conversion chip for an electro-explosive device. The semiconductor bridge energy conversion chip comprises polycrystalline silicon bridge steps, electrodes and an insulating layer, two ends of the polycrystalline silicon bridge steps, which are perpendicular to electric current direction, are in inner concave circular arc shapes, two ends of the bridge area of a semiconductor bridge are merely designed to be circular arc bridge areas, so that the field strength density is uniform in electromagnetic field environment, the local concentration of field strength and density increasing are not prone to occur, simultaneously the circular arc bridge areas of the two ends can meet requirement of low ignition critical energy of an initiating explosive device, the structure is extremely simple, cost increasing is not required, requirements of low ignition critical energy, reliable ignition and anti-static strength improvement can be easily and synchronously achieved.

Description

technical field [0001] The invention belongs to the field of electrical explosive devices, in particular to a semiconductor bridge transducer chip for electrical explosive devices. Background technique [0002] Semiconductor bridge (SCB) pyrotechnics refers to the use of semiconductor chips as the ignition transducing element of electric pyrotechnics. Under the action of input electric energy, the semiconductor bridge quickly gasifies to form high-temperature plasma, which triggers pyrotechnic agents. [0003] The SCB chip uses microelectronics technology to heavily dope the semiconductor substrate to form a conductive layer. The shape and quality of the bridge can be designed according to the input electric energy, and the corresponding semiconductor ignition bridge can be obtained with different output energies. [0004] The shape of the bridge region of a typical semiconductor bridge chip is rectangular and has sharp corners. For example, the bridge region pattern of the ...

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Problems solved by technology

However, these methods need to increase the number of devices, which brings problems such as complex process, increased cost, and increased difficulty in reliability.

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