Semiconductor bridge energy conversion chip for electro-explosive device

A technology for electrical explosives and semiconductors, which is used in offensive equipment, blasting cylinders, weapon accessories, etc., can solve the problems of increasing components, increasing costs, and increasing difficulty in reliability, and achieves improved antistatic strength, uniform field strength density, simple structure

Inactive Publication Date: 2013-02-27
NANJING UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these methods need to increase the number of devices, which brings problems such as complex process, increased cost, and increased difficulty in reliability.

Method used

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  • Semiconductor bridge energy conversion chip for electro-explosive device
  • Semiconductor bridge energy conversion chip for electro-explosive device
  • Semiconductor bridge energy conversion chip for electro-explosive device

Examples

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Effect test

Embodiment 1

[0019] Embodiment 1: as figure 2 As shown, a semiconductor bridge transducing chip for electrical pyrotechnics includes a polysilicon bridge step 1, an electrode 4 and an insulating layer 3. The two ends of the polysilicon bridge step 1 and the direction perpendicular to the current direction are arc-shaped; the electrodes 4 Adopt the structure of titanium-silicon nitride-aluminum silicon copper.

Embodiment 2

[0020] Embodiment 2: as image 3 As shown, a semiconductor bridge transducing chip for electrical explosive devices includes a polysilicon bridge step 1, an electrode 4 and an insulating layer 3. The two ends of the polysilicon bridge step 1 and the direction perpendicular to the current direction are arc-shaped, and the polysilicon bridge step 1 The two ends perpendicular to the current direction and the two sides of the polysilicon bridge step 1 parallel to the current direction adopt a circular arc transition, and the electrode 4 adopts the structure of titanium-tungsten nitrogen-gold.

Embodiment 3

[0021] Embodiment 3: A semiconductor bridge transducing chip for electrical pyrotechnics, comprising a polysilicon bridge step 1, an electrode 4 and an insulating layer 3, the two ends of the polysilicon bridge step 1 perpendicular to the current direction are arc-shaped, and the polysilicon bridge The two ends of the step 1 perpendicular to the current direction and the two sides of the polysilicon bridge step 1 parallel to the current direction adopt a circular arc transition, and the electrode 4 adopts a titanium-cobalt-gold structure.

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PUM

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Abstract

The invention discloses a semiconductor bridge energy conversion chip for an electro-explosive device. The semiconductor bridge energy conversion chip comprises polycrystalline silicon bridge steps, electrodes and an insulating layer, two ends of the polycrystalline silicon bridge steps, which are perpendicular to electric current direction, are in inner concave circular arc shapes, two ends of the bridge area of a semiconductor bridge are merely designed to be circular arc bridge areas, so that the field strength density is uniform in electromagnetic field environment, the local concentration of field strength and density increasing are not prone to occur, simultaneously the circular arc bridge areas of the two ends can meet requirement of low ignition critical energy of an initiating explosive device, the structure is extremely simple, cost increasing is not required, requirements of low ignition critical energy, reliable ignition and anti-static strength improvement can be easily and synchronously achieved.

Description

technical field [0001] The invention belongs to the field of electrical explosive devices, in particular to a semiconductor bridge transducer chip for electrical explosive devices. Background technique [0002] Semiconductor bridge (SCB) pyrotechnics refers to the use of semiconductor chips as the ignition transducing element of electric pyrotechnics. Under the action of input electric energy, the semiconductor bridge quickly gasifies to form high-temperature plasma, which triggers pyrotechnic agents. [0003] The SCB chip uses microelectronics technology to heavily dope the semiconductor substrate to form a conductive layer. The shape and quality of the bridge can be designed according to the input electric energy, and the corresponding semiconductor ignition bridge can be obtained with different output energies. [0004] The shape of the bridge region of a typical semiconductor bridge chip is rectangular and has sharp corners. For example, the bridge region pattern of the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F42B3/13
Inventor 秦志春田桂蓉叶家海朱顺官张琳徐振相
Owner NANJING UNIV OF SCI & TECH
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