Thin film circuit board manufacturing method and thin film circuit board
A thin-film circuit board and manufacturing method technology, which can be applied in multilayer circuit manufacturing, printed circuit components, etc., can solve problems such as uneven coating, influence of diaphragm bonding strength, poor waterproofness of thin-film circuit boards, etc. Waterproof performance and effect of improving diaphragm bonding strength
Active Publication Date: 2015-11-18
DARFON ELECTRONICS (SUZHOU) CO LTD +1
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Problems solved by technology
[0003] The lamination between the above-mentioned insulating film, the upper circuit film and the lower circuit film is usually carried out by coating waterproof glue. However, this method often results in uneven coating between the insulating film and the upper circuit. Bubbles are generated between the diaphragm and the lower circuit diaphragm, which leads to poor waterproofing of the thin film circuit board and affects the bonding strength of the diaphragm
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[0018] In order to have a further understanding of the purpose, structure, features, and functions of the present invention, the following detailed descriptions are provided in conjunction with the embodiments.
[0019] see figure 1 as well as figure 2 , figure 1 It is a partial schematic view of the thin film circuit board 10 proposed according to the first embodiment of the present invention, figure 2 for figure 1 A partial cross-sectional schematic diagram of the thin film circuit board 10 along the section line A-A'. The thin film circuit board 10 is preferably applied to a keyboard (but not limited thereto), for the user to trigger a key signal by pressing a key, such as figure 1 as well as figure 2 As shown, the thin film circuit board 10 includes a first circuit film 12 , a second circuit film 14 , and an insulating film 16 . The insulating film 16 is fused and attached between the first circuit film 12 and the second circuit film 14 through a heat-melt bonding...
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The invention relates to a film circuit board manufacturing method and a film circuit board, in particular to the film circuit board manufacturing method for attaching an insulating film between a first circuit film and a second circuit film in a fused way by using a hot melt jointing process as well as the film circuit board. According to the invention, through the design of attaching the insulating film between the first circuit film and the second circuit film in a fused way by using the hot melt jointing process, bubbles are certainly avoided. Therefore, through the adoption of the film circuit board manufacturing method provided by the invention, problems of poor waterproofness of the film circuit board and influences on film jointing strength caused by nonuniform waterproof glue coating in the prior art can be effectively solved; and therefore, the waterproofness and the film jointing strength of the film circuit board are greatly enhanced.
Description
technical field [0001] The present invention relates to a method for manufacturing a thin film circuit board and the thin film circuit board, especially to a thin film circuit that uses a thermal fusion bonding process to fuse and attach an insulating film between a first circuit film and a second circuit film Board manufacturing method and thin film circuit board thereof. Background technique [0002] Generally speaking, the keyboard uses a thin film circuit board (membrane) to trigger the key signal, wherein the thin film circuit board is composed of an upper circuit membrane, an insulating membrane and a lower circuit membrane. In short, as long as the user presses down the key on the keyboard, the corresponding contact point on the upper circuit diaphragm can be conducted with the corresponding contact point on the lower circuit diaphragm through the hole in the insulating diaphragm, thus generating Corresponding key signal. [0003] The lamination between the above-me...
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IPC IPC(8): H05K3/46H05K1/02
Inventor 江治湘
Owner DARFON ELECTRONICS (SUZHOU) CO LTD