Temperature equalization plate structure and manufacturing method thereof

A manufacturing method and vapor chamber technology, which are applied in semiconductor/solid-state device manufacturing, lighting and heating equipment, electrical components, etc., can solve problems such as damage to illuminants, increase in thermal resistance at the bonding interface, and heat accumulation, and achieve improved bonding. The effect of the rupture problem

Active Publication Date: 2013-03-06
ASIA VITAL COMPONENTS SHENZHEN CO LTD
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Problems solved by technology

[0007] Furthermore, for example, in the application field of LED heat dissipation, the thermal expansion coefficient of aluminum and copper is much higher than that of sapphire, which may easily lead to thermal fatigue on the bonding surface of high-brightness LEDs under long-term use. Boundary crack (crack), resulting in increased thermal resistance of the joint interface
For high-brightness LED products, when the thermal resistance of the heat dissipation interface rises, it will cause heat accumulation and damage the LED chip, resulting in permanent damage to the luminous body

Method used

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  • Temperature equalization plate structure and manufacturing method thereof
  • Temperature equalization plate structure and manufacturing method thereof
  • Temperature equalization plate structure and manufacturing method thereof

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[0035] The above-mentioned purpose of the present invention and its structural and functional characteristics will be described based on the preferred embodiments of the accompanying drawings.

[0036] see Figure 1a , Figure 1b , figure 2 , is a three-dimensional exploded and assembled view and a cross-sectional view of the first embodiment of the chamber structure of the present invention. As shown in the figure, the chamber structure includes: a body 1;

[0037] The body 1 has a metal plate body 11 and a ceramic plate body 12, the metal plate body 11 covers the ceramic plate body 12 correspondingly, and jointly defines a chamber 13, the chamber 13 has a capillary structure 14 and A support structure 15 , the capillary structure 14 is arranged on the inner wall of the chamber 13 , the support structure 15 connects the metal plate body 11 and the ceramic plate body 12 , and a working fluid 16 is provided in the chamber.

[0038] The capillary structure 14 is illustrated a...

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Abstract

The invention relates to a temperature equalization plate structure and a manufacturing method o temperature equalization plate structure. The temperature equalization plate structure comprises a body with a metal plate body and a ceramic plate body, the metal plate body and the ceramic plate body are covered together correspondingly to jointly define a chamber, the chamber is provided with a capillary structure as well as a support structure and an operating fluid, the metal plate body and the ceramic plate body are combined and then jointly combined with the capillary structure and the support structure through a welding or directly copper-cladding method, and the temperature equalization plate and the manufacturing method provided by the invention are used for solving the problem of cracking of a jointing interface between a temperature equalization plate and a heating source due to thermal fatigue.

Description

technical field [0001] A vapor chamber structure and its manufacturing method, especially a vapor chamber that combines a metal material and a ceramic material to improve the uniformity of the cracking problem of the joint boundary between the vapor chamber and the heat source due to thermal fatigue. Warm plate structure and manufacturing method thereof. Background technique [0002] By the way, with the advancement of semiconductor technology, the volume of integrated circuits is gradually shrinking. In order to enable integrated circuits to process more data, integrated circuits with the same volume can accommodate several times more than before. Computing elements. When the number of computing elements in the integrated circuit increases, the heat energy generated by the computing elements will also increase. Taking the common central processing unit as an example, when the workload is high and full, the central processing unit The heat emitted by the circuit breaker is ...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/427F28D15/04H01L21/48
Inventor 杨修维
Owner ASIA VITAL COMPONENTS SHENZHEN CO LTD
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