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Light emitting device and LED bulb

A technology of LED light bulbs and light-emitting devices, which can be used in lighting devices, components of lighting devices, semiconductor devices of light-emitting elements, etc., and can solve problems such as insufficient light

Active Publication Date: 2015-06-17
首尔半导体有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In white LED lamps composed of ultraviolet or violet LEDs and BGR or BYR phosphors, sufficient light may not be obtained due to the arrangement shape of the LED chip, sealing structure, etc.

Method used

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  • Light emitting device and LED bulb
  • Light emitting device and LED bulb
  • Light emitting device and LED bulb

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～4

[0079] First, LED chips with a chip shape of 0.4×0.4 mm were arranged in 5 series×5 parallel connections on an alumina substrate with a shape of 30×30 mm at the chip intervals P1 and P2 shown in Table 1, respectively. The emission wavelengths of the LED chips are shown in Table 1. Next, if figure 1 As shown, the arrays of chips connected in series are separately sealed with transparent silicone resin. The silicone resin seals the LED chips of each chip row in a linear shape. White light-emitting devices of Examples 1 to 4 were produced by respectively providing covering members having fluorescent films formed on the inner surfaces as described below on the above-mentioned LED modules. These white light-emitting devices were used for characteristic evaluation described later.

[0080] A fluorescent film was formed as described below. First, Eu-activated alkaline earth chlorophosphate ((Sr 0.604 Ba 0.394 Eu 0.002 )5 ( PO 4 ) 3 Cl) Phosphor As blue phosphor, prepare Eu ...

Embodiment 5～8

[0091] First, LED chips with a chip shape of 0.6×0.6 mm were arranged in 4 series×4 parallel connections on an alumina substrate with a shape of 35×35 mm at the chip intervals P1 and P2 shown in Table 3, respectively. The emission wavelengths of the LED chips are shown in Table 3. Next, if image 3 As shown, each LED chip is separately sealed with transparent silicone resin. White light-emitting devices of Examples 5 to 8 were manufactured by respectively providing covering members having fluorescent films formed on the inner surfaces as described below on the above-mentioned LED modules. The characteristics of these white light-emitting devices were measured in the same manner as in Example 1. Table 4 shows the results.

[0092] A fluorescent film was formed as described below. First, Eu-activated alkaline earth chlorophosphate ((Sr 0.604 Ba 0.394 Eu 0.002 ) 5 (PO 4 ) 3 Cl) Phosphor As blue phosphor, prepare Eu and Mn activated alkaline earth silicate ((Sr 0.675 Ba...

Embodiment 9～12

[0102] First, on an alumina substrate with a shape of 25 × 25 mm, LEDs with a chip shape of 0.7 × 0.25 mm (the average value of the long and short sides: 0.475 mm) are placed at the chip intervals P1 and P2 shown in Table 5, respectively. The chip is configured as 5 series × 5 parallel. The emission wavelengths of the LED chips are shown in Table 5. Next, if Image 6 As shown, the arrays of chips connected in series are separately sealed with transparent silicone resin. The above-mentioned LED modules were fixed on the base (heat sink), and spherical covers with fluorescent films formed on the inner surfaces as described below were respectively placed on the LED modules, thereby producing LED light bulbs of Examples 9 to 12. . The characteristics of these LED light bulbs were measured in the same manner as in Example 1. Table 6 shows the results.

[0103] A fluorescent film was formed as described below. First, Eu-activated alkaline earth chlorophosphate ((Sr 0.604 Ba ...

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PUM

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Abstract

A light emitting device (1) according to an embodiment includes an LED module (4) and a cover member (5). The LED module (4) includes four or more ultraviolet or violet emitting LED chips (3) arranged on a substrate (2). A fluorescent film (6) is provided along the cover member (5) and spaced from the LED chips (3). Where the distance from the center of one LED chip (3) to that of another LED chip (3) positioned nearest thereto is represented by P, and the length of one side of the LED chips if the LED chips are square or the average length of the long side and the short side if the LED chips are rectangles is represented by L, the four or more LED chips (3) are arranged in a matrix satisfying the condition of 2.6L = P = 10L.

Description

technical field [0001] Embodiments of the present invention relate to light emitting devices and LED bulbs. Background technique [0002] Light emitting devices using light-emitting secondary lights (LEDs) are widely used in lighting devices such as backlights of liquid crystal display devices, signaling devices, various switches, vehicle lamps, and general lighting. In particular, white light-emitting LED lamps (white LED lamps), which are combinations of LEDs and phosphors, are attracting attention as a substitute for lighting fixtures using incandescent bulbs and fluorescent lamps, and their development is rapidly progressing. As a light bulb to which a white LED lamp is applied (hereinafter referred to as an LED light bulb), for example, an integrated structure is known in which an LED module is installed in a globe mounted on a base portion having a bulb socket, and A lighting circuit for LED chips is provided in the base part, wherein the LED module includes a plurali...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/50F21S2/00F21V9/16F21Y101/02
CPCH01L25/0753H01L33/507H01L2924/09701H01L2224/48H01L2224/45144F21K9/64F21Y2115/10H01L2924/00
Inventor 中川胜利大屋恭正碓井大地山川昌彦白川康博近藤弘康
Owner 首尔半导体有限公司