Chamfering machine capable of processing non-standard silicon wafer

Abstract

The invention provides a chamfering machine capable of processing a non-standard silicon wafer. The chamfering machine comprises a correcting system, wherein the correcting system comprises a wafer conveying arm; a round wafer absorption head is arranged at one end of the wafer conveying arm; the wafer absorption head is provided with two arch-shaped correcting clamp plates; strip-shaped positioning blocks are arranged at the two ends of each correcting clamp plate; one end of each positioning block is fixed to each correcting clamp plate through a shaft; each positioning block can be used for adjusting an angle according to the practical processing need; and a positioning wheel is arranged at the other end of each positioning block. The chamfering machine has the benefits as follows: the processing capability of the non-standard silicon wafer is improved under the condition that the original processing capability of equipment is maintained, so that the production and processing capabilities of the equipment are improved.

Description

technical field [0001] The invention relates to a chamfering machine, in particular to a chamfering machine capable of processing non-standard silicon wafers. Background technique [0002] The processing of silicon wafers generally requires the use of chamfering equipment. With the increasing application of non-standard silicon wafers, the existing chamfering machines need to have a certain ability to process non-standard silicon wafers. D37-378 / YL domestic chamfering The machine is mainly used for the edge processing of semiconductor silicon wafers, which can automatically realize accurate chamfering, but there is a technical problem that it does not have the ability to process non-standard silicon wafers with a diameter less than 73mm. Contents of the invention [0003] The problem to be solved by the present invention is to provide a chamfering machine capable of processing non-standard silicon wafers. [0004] In order to solve the above technical problems, the techni...

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Problems solved by technology

[0002] The processing of silicon wafers generally requires the use of chamfering equipment. With the increasing application of non-standard silicon wafers, the existing chamfering machines need to have a certain ability to process non-standard silicon wafers. D37-378 / YL domestic chamfering The machine is mainly used for the edge processing of semiconductor silicon wafers, which can automatically realize accurate chamfering, but there is a technical problem that it does not have the ability to process non-standard silicon wafers with a diameter less than 73mm

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