Wiring failure monitoring system for internal key of IGBT module and operating method thereof

Abstract

The invention discloses a wiring failure monitoring system for an internal key of an IGBT (insulated gate bipolar transistor) module. The wiring failure monitoring system is characterized in that the system comprises a gate drive and protective circuit unit, a beam voltage and current monitoring unit, a gate voltage monitoring unit, a bottom plate temperature acquiring unit, a controller unit and a man-machine interface display unit; the operating method of the system comprises the steps of signal acquiring, signal conditioning, signal conversion, failure diagnosis and man-machine exchange; the wiring failure monitoring system has the advantages that (1) a failure monitoring method is quick and accurate; (2) a wiring failure of the internal key of an IGBT is monitored in real time; (3) the rapidity and instantaneity of the monitoring are good; (4) the system is higher accuracy, and has a commercial application prospect; and (5) the system has generality for a power semiconductor device controlled by a switch.

Description

(1) Technical field: [0001] The invention relates to the technical field of fault diagnosis of power semiconductor devices, in particular to an IGBT (Insulated Gate Bipolar Transistor—Insulated Gate Bipolar Transistor, referred to as IGBT) module internal bond wire fault monitoring system and its working method. (2) Background technology: [0002] With the continuous advancement of power electronic technology, the role of power electronic systems in many industrial fields has become increasingly prominent, such as motor drives, electric vehicles, and solar and wind energy. The ever-expanding application fields of power electronic systems make their reliability, lifetime, health monitoring and predictive maintenance very important. In addition, one of the most prone to failure points of power electronic systems is power semiconductor devices, so studying the reliability of power semiconductor devices plays an important role in enhancing the reliability of the system and prolo...

AI Technical Summary

Problems solved by technology

[0009] 2. Except for a small number of power semiconductor devices with characteristic models implanted with temperature sensors, commonly used power modules cannot place sensors inside to monitor their health status;

[0010] 3. The fault of the key wire is affected by various external factors, and it is difficult to judge the fault state

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