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led packaging device

A technology of LED encapsulation and resin, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve problems that have not been discussed, and achieve the effect of preventing color shift and good color reproducibility

Active Publication Date: 2016-05-18
MITSUBISHI ELECTRIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0016] In this way, in Patent Document 2 or Patent Document 3 including the above-mentioned Patent Document 1, there has been no study on the improvement of color shift by the resin molding.

Method used

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Examples

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Embodiment

[0062] Next, examples will be described.

[0063] Such as figure 1 As shown, the LEDs 2R, 2B, and 2G are installed on the lead frame 1, and the first resin molding 11 made of silicone rubber with a refractive index of 1.41 and the second resin molding made of epoxy resin with a refractive index of 1.54 are used. 12 to make the embodiment. It should be noted that 0.5% by weight of a diffusing agent was added to the first resin molding 11 .

[0064] As a comparative example, a structure in which only the second resin mold 12 based on epoxy resin was formed without the first resin mold 11 was produced.

[0065] figure 2 is the measurement result of the light distribution characteristic of the above-mentioned embodiment, image 3 It is the measurement result of the light distribution characteristic of a comparative example (horizontal placement). It is obvious to observe these results that the characteristic curves of R (red), G (green), and B (blue) in the comparative examp...

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Abstract

The present invention provides an LED packaging device in which color shift is prevented by a resin mold. In an LED package device having LEDs (2R, 2B, 2G) having at least three different wavelengths and a lead frame (1) on which each LED (2R, 2B, 2G) is mounted, the lead frame (1) A cup-shaped portion (5) on which each of the LEDs (2R, 2B, 2G) is mounted is provided, and each of the mounted LEDs (2R, 2B, 2G) The LED (2R, 2B, 2G) is covered with a translucent first resin molding (11), and a translucent second resin mold is formed to at least cover the opening of the cup-shaped portion (5). The resin molded part (12), the refractive index of the first resin molded part (11) and the second resin molded part (12) are different from each other. Thereby, color shift is effectively prevented, and favorable color reproducibility is exhibited when it is used for a color display etc.

Description

technical field [0001] The present invention relates to an LED package device that mounts an LED chip and can be used, for example, as a light source of a liquid crystal display device or the like. Background technique [0002] LEDs are long-lived, compact, and have excellent luminous efficiency, so they are widely used in various applications such as displays, backlights, and lighting. Among them, an LED package device in which LED chips of three colors are mounted on a single package can be used in a color display as a device capable of expressing full colors through current distribution. Such an LED packaging device is disclosed, for example, in the content related to the following patent document 1. [0003] prior art literature [0004] 1: Japanese Patent No. 3476611 [0005] 2: Japanese Patent Laid-Open No. 2005-77853 [0006] 3: Japanese Special Examination No. 2007-536718 [0007] Summary of the invention [0008] The problem to be solved by the invention [0...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/56
CPCH01L25/0753H01L33/56H01L2224/48091H01L2224/48247H01L2924/00014
Inventor 阿部修寺西将人
Owner MITSUBISHI ELECTRIC CORP
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