A splicing method for modular floor heating
Patent Information
- Authority / Receiving Office
- CN Β· China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SHANGHAI JIUNENG ENERGY SCI & TECH DEV
- Publication Date
- 2015-10-28
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Abstract
Description
technical field
[0001] The invention relates to floor heating, in particular to a splicing method for modular floor heating. Background technique
[0002] At present, floor heating has become the mainstream of domestic heating methods. Floor heating mainly includes wet heating and dry heating. Wet heating is multi-layer on-site assembly, and the surface layer uses poured concrete as the load-bearing and heat-transfer medium. The construction is extremely cumbersome. The floor of the building bears a lot of load and occupies a large proportion of the floor height, which compresses the indoor floor height and reduces heating energy consumption. High, very uneconomical. Although dry heating overcomes some of the shortcomings of wet floor heating, when laying floor heating, it is necessary to lay a heat-conducting layer and a heat-insulating layer. The coils must be fixed separately, resulting in the workload of on-site assembly is still comparable to that of wet heating const...