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Semiconductor package

A package and semiconductor technology, which is applied in semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc., can solve the problems of poor thermal conductivity of packages and chips affecting work efficiency

Active Publication Date: 2013-04-03
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the chip generates high heat, and the thermal conductivity of the package is usually not good, resulting in excessive temperature around the chip and affecting its working efficiency

Method used

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  • Semiconductor package
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Embodiment Construction

[0025] Please refer to figure 1 , which shows a cross-sectional view of a semiconductor package according to an embodiment of the present invention. The semiconductor package 100 includes a substrate 110 , a chip 120 , a package body 130 , a heat sink 140 and a barb structure layer 150 .

[0026] The substrate 110 may be an organic substrate, a ceramic substrate, a silicon substrate or a metal carrier. In addition, the substrate 110 may be a single-layer or multi-layer circuit substrate.

[0027] The chip 120 is located on the upper surface 110u of the substrate 110 with its active surface 120u facing upwards, and is electrically connected to the substrate 110 through at least one bonding wire 125 , and the bonding wire 125 may be a gold wire or a copper wire. In another example, the chip 120 may be a flip chip, which is disposed on the upper surface 110u of the substrate 110 with its active surface 120u facing downward and is electrically connected to the substrate 110 thro...

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Abstract

A semiconductor package comprises a substrate, a chip, a package, a radiating plate and a barb structural layer. The chip is arranged on the substrate. The package covers the chip and is provided with an upper surface. The radiating plate is provided with a rough surface and is formed on the upper surface of the package via the rough surface. The barb structural layer covers the rough surface and is positioned between the package and the radiating plate, so that the binding performance between the radiating plate and the package is improved.

Description

technical field [0001] The present invention relates to a semiconductor package, and in particular to a semiconductor package with heat dissipation function. Background technique [0002] A traditional semiconductor package includes a package body and a chip, wherein the package body covers the chip, and the chip provides the function of the semiconductor package. However, the chip generates high heat, and the thermal conductivity of the package is usually poor, resulting in excessively high temperatures around the chip and affecting its working efficiency. Therefore, how to dissipate the heat of the chip has become one of the focuses of the industry. Contents of the invention [0003] The present invention relates to a semiconductor package. In one example, the semiconductor package includes a heat sink for dissipating heat from a chip. [0004] According to the present invention, a semiconductor package is proposed. The semiconductor package includes a substrate, a ch...

Claims

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Application Information

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IPC IPC(8): H01L23/367H01L23/31
CPCH01L2224/48091H01L2224/48227H01L2924/15311
Inventor 卢俊庭李天伦刘承政詹士伟孙铭伟邱彬鸿
Owner ADVANCED SEMICON ENG INC
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