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Device and method for evaluating relation of interface temperature and interface heat exchange coefficient

A technology of interface heat transfer coefficient and temperature detection device, which is applied in the direction of using electrical devices, thermometers, and thermometers using electric/magnetic elements that are directly sensitive to heat, can solve problems that do not involve contact interface temperature and interface heat transfer coefficient, etc.

Active Publication Date: 2013-04-10
滕州市产品质量监督检验所
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  • Abstract
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  • Application Information

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Problems solved by technology

At present, none of the published literature and patents involves the relationship between the contact interface temperature and the interface heat transfer coefficient

Method used

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  • Device and method for evaluating relation of interface temperature and interface heat exchange coefficient
  • Device and method for evaluating relation of interface temperature and interface heat exchange coefficient
  • Device and method for evaluating relation of interface temperature and interface heat exchange coefficient

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Embodiment Construction

[0070] The present invention will be further described below in conjunction with the accompanying drawings.

[0071] A device for evaluating the relationship between mold surface temperature and interface heat transfer coefficient during hot stamping, including a cooling device, a sample fixing device and a temperature detection device. The cooling device includes an upper tooling 11 and a lower tooling 10, the upper tooling 11 and the lower tooling 10 are connected by fastening screws, the lower surface of the upper tooling 11 in contact with the lower tooling 10 is provided with a sealing groove 13, and the sealing A sealing ring 8 is installed in the groove 13, and the cooling device is sealed through the compression deformation of the sealing ring 8 to prevent leakage of cooling water. The surface thickness of the upper tooling 11 is 2mm, which reduces the influence of the change of the thermal physical property parameters of the tooling material on the calculation accurac...

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Abstract

Provided is a device for evaluating relation of interface temperature and an interface heat exchange coefficient between a die and a sample in a hot stamping process. The device for evaluating the relation of the interface temperature and the interface heat exchange coefficient comprises a cooling device, a sample fixing device, a temperature detecting device and a data processing system. The cooling device comprises an upper tool and a lower tool, the sample fixing device is arranged on the upper surface of the upper tool, and the temperature detecting device is arranged on one side, close to the upper tool, of the sample fixing device. A plurality of support poles are arranged inside the upper tool, the cavities among the support poles are cooling water channels, and the cooling water channels are connected with a cooling water inlet and a cooling water outlet respectively. The invention further discloses a method for evaluating the relation of the interface temperature and the interface heat exchange coefficient between the die and the sample in the hot stamping process, and supplies corresponding theoretical basis to the test of interface coefficient.

Description

technical field [0001] The invention relates to a device and method for measuring the relationship between interface temperature and interface heat transfer coefficient, in particular to a device and method for testing the relationship between mold surface temperature and interface heat transfer coefficient during hot stamping, and belongs to the technical field of high-strength steel plate hot stamping. Background technique [0002] The conventional heat conduction process is based on the known initial conditions or boundary conditions to solve the temperature change inside the heat transfer body, which is a well-posed problem. The Inverse Heat Conduction Problem (IHCP) is an ill-posed problem. IHCP is to calculate the boundary conditions or initial conditions of the heat transfer body according to the temperature change of the heat transfer body: that is, by installing a thermal sensor inside the heat transfer body, using the thermal sensor to record the temperature change...

Claims

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Application Information

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IPC IPC(8): G01K7/02G01N25/20
Inventor 贺连芳李辉平崔洪芝孙金全
Owner 滕州市产品质量监督检验所
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