Circuit board and manufacture method thereof.
A manufacturing method and technology of circuit boards, which are applied in the fields of printed circuit manufacturing, printed circuits, printed circuit components, etc., can solve the problems of reducing the reliability of circuit boards, reducing the adhesion between circuit layers and dielectric layers, etc., so as to improve reliability Effect
Inactive Publication Date: 2013-04-17
UNIMICRON TECH CORP
View PDF8 Cites 2 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0005] However, the ultra-thin copper foil with low roughness will reduce the adhesion between the circuit layer and the dielectric layer, causing the outermost circuit layer to be easily peeled off from the dielectric layer, thereby reducing the reliability of the circuit board
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0035] Figure 1A to Figure 1D It is a sectional view of the manufacturing process of the circuit board according to an embodiment of the present invention. In this embodiment, a circuit board with circuit layers on opposite sides of the core layer will be used for illustration, but the invention is not limited thereto. First, please refer to Figure 1A , providing a dielectric core layer 100 . The dielectric core layer 100 has a first surface 100a and a second surface 100b opposite to each other. Then, the pre-adhesive layer 102a and the conductive layer 104a are laminated on the first surface 100a, and the pre-adhesive layer 102b and the conductive layer 104b are laminated on the second surface 100b. The material of the pre-adhesive layers 102 a and 102 b is, for example, B-stage resin, which is in a semi-cured state before lamination and is in a cured state after thermal lamination. Therefore, after lamination, the pre-adhesive layer 102a can firmly press the conductive ...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses a circuit board and a manufacture method thereof. The manufacture method comprises the following steps that a first pre-gluing layer and a first electricity conducting layer are first laminated on a dielectric core layer, wherein the unevenness of the surface of the first electricity conducting layer, facing the dielectric core layer is smaller than or equal to 1.5 micrometers; then, first communicating holes are formed in the first electricity conducting layer, the first pre-gluing layer and the dielectric core layer; the first electricity conducting layer and the first pre-gluing layer are patterned so as to form a first circuit layer; a first dielectric layer, a second pre-gluing layer and a second electricity conducting layer are laminated on the first circuit layer, wherein the unevenness of the surface of the second electricity conducting layer, facing the first dielectric layer is bigger than 1.5 micrometers and smaller than 3 micrometers; second communicating holes are formed in the second electricity conducting layer, the second pre-gluing layer and the first dielectric layer; and finally, the second electricity conducting layer and the second pre-gluing layer are patterned so as to form a second circuit layer.
Description
technical field [0001] The invention relates to a circuit board and a manufacturing method thereof, and in particular to a circuit board containing thin circuits and having high reliability and a manufacturing method thereof. Background technique [0002] In recent years, with the rapid development of electronic technology and the emergence of high-tech electronic industries, electronic products with more humanization and better functions are constantly being introduced, and are designed towards the trend of light, thin, short and small. Circuit boards with conductive traces are usually arranged in these electronic products. [0003] In order to increase the wiring density in the circuit board, the circuit layer in the circuit board is generally fabricated with a line width of more than 40 μm by using a subtractive process. However, for a line width below 40 μm (generally referred to as a thin line), using a subtractive manufacturing process to fabricate the wiring layer wi...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/40H05K3/18H05K1/02
Inventor 余丞博黄培彰林爱华黄瀚霈
Owner UNIMICRON TECH CORP