Drilling method of high-order circuit boards

Abstract

The invention discloses a drilling method of high-order circuit boards. The drilling method includes the following steps: (1) machine tool installation, wherein a high-order circuit board needing to be drilled is arranged on a machine tool of a drilling machine and is prepared for drilling. The boards with a high plating thickness and a large drilling aspect ratio normally are permitted to place on the machine tool of the drilling machine in a one-piece or pile mode; (2) hole drilling, wherein three hole drillings are designed at the same drilling position, at the first drilling time, a drilling bit drills about 40% of the whole board thickness and stops, then the drilling bit retracts to a position about 10% of the board thickness for heat dissipation and scrap discharge. At a second drilling time, the drilling bit drills about 70% of the board thickness, and then retracts to the position about 10% of the board thickness for heat dissipation and scrap discharge. At a third drilling time, the drilling bit drills 110% of the whole board thickness, and the drilling operation of the position is finished, and thus the steps form a cycle; (3) and shipment, wherein the drilling manufacturing is finished, and a next working procedure manufacturing is carried out. According to the drilling method of the high-order circuit board, drilling quality of the circuit boards with the high plating thickness and the large drilling aspect ratio can be guaranteed, drill bit broken rate of the drilling bit is effectively reduced, and meanwhile the problem that high-order circuit boards can not be produced is solved.

Description

technical field [0001] The invention relates to a method for drilling a circuit board, in particular to a method for drilling a high-order circuit board with high aspect ratio drilling, and belongs to the technical field of circuit board processing. Background technique [0002] For a long time, circuit boards with thick boards and large drilling aspect ratios have relatively large quality defects when drilling small-diameter holes. The main reason is that the ratio between the thickness and diameter of the drilled holes is large. In the way of permanent direct drilling, the bending tendency of the drill needle increases, and the deflection force of the drill needle increases, resulting in the breakage of the drill bit and the increase of the hole diameter error. The chip capacity is reduced, the drilling dust and the glass yarn in the plate remain in the chip groove of the drill, and the heat dissipation of the drill cannot be guaranteed, so the drilled hole shows a large h...

AI Technical Summary

Problems solved by technology

[0002] For a long time, circuit boards with thick boards and large drilling aspect ratios have relatively large quality defects when drilling small-diameter holes. The main reason is that the ratio between the thickness and diameter of the drilled holes is large. In the way of permanent direct drilling, the bending tendency of the drill needle increases, and the deflection force of the drill needle increases, resulting in the breakage of the drill bit and the increase of the hole diameter error. The chip capacity is reduced, the drilling dust and the glass yarn in the plate remain in the chip groove of the drill, and the heat dissipation of the drill cannot be guaranteed, so the drilled hole shows a large hole thickness or hole deformation, the above The problem has plagued the production of circuit boards for a long time, especially if the high-end circuit boards cannot be improved, it will directly lead to abnormal reliability and scrap