A kind of PCB drilling cover plate and preparation method thereof
A cover plate and resin technology, applied in the field of PCB drilling cover plate and its preparation, can solve the problems of slow PCB processing efficiency, poor positioning effect of PCB cover plate, and high needle breakage rate, so as to increase the number of PCB laminated layers, The effect of good chip removal and quality improvement
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Embodiment 1
[0040] a. Preparation of heat-dissipating resin: first add 50% water to the reactor, keep the temperature at 80°C, and stir at a rate of 90r / min; then add 20% polyvinyl alcohol, stir at room temperature for 2 hours; then add 1% polyacrylic acid resin, Stir for 1h; then add 28% acrylic acid emulsion, stir at room temperature for 0.5h; finally add 1% silane coupling agent, stir for 1h at room temperature.
[0041] b. The resin and bleached wood pulp paper in step a are impregnated with a speed of 25m / min and a temperature of 100°C to make a resin impregnated paper with a gluing amount of 30% and a uniformity of 1%.
[0042]c. Lay the phenolic resin sheet and the resin-impregnated paper together, place them in a press for pressing, the pressing temperature is 80°C, the pressing pressure is 2 MPa, and the pressing time is 30 minutes.
[0043] Results: The warpage of the plate was less than 1%, and the adhesion was good. The cpk of the drilled hole was 1.534, the hole diameter was ...
Embodiment 2
[0045] a. Preparation of heat-dissipating resin: first add 45% water to the reactor, keep the temperature at 80°C, and stir at a rate of 90r / min; then add 20% polyvinyl alcohol, stir at room temperature for 2 hours; then add 1% polyacrylic acid resin, Stir for 1h; then add 33% acrylic acid emulsion, stir at room temperature for 0.5h; finally add 1% silane coupling agent, stir for 1h at room temperature.
[0046] b. The resin in step a and the high-grade release paper are impregnated with a vehicle speed of 23m / min and a temperature of 100°C to make a resin-impregnated paper with a gluing amount of 33% and a uniformity of 1.2%.
[0047] c. Lay the phenolic resin sheet and the resin-impregnated paper together, place them in a press for pressing, the pressing temperature is 90°C, the pressing pressure is 2 MPa, and the pressing time is 30 minutes.
[0048] Results: The warpage of the plate was less than 1%, the bonding was good, the cpk of the drilled hole was 1.54, the hole diam...
Embodiment 3
[0050] a. Preparation of heat-dissipating resin: first add 40% water to the reactor, keep the temperature at 85°C, and stir at a rate of 90r / min; then add 1% polyacrylic acid resin, stir at room temperature for 1 hour; then add 43% polyethylene glycol, Stir at room temperature for 1h; then add 25% acrylic acid emulsion, stir for 0.5h at room temperature; finally add 1% silane coupling agent, stir for 1h at room temperature.
[0051] b. The resin and bleached wood pulp paper in step a were impregnated with a speed of 22m / min and a temperature of 100°C to make a resin-impregnated paper with a gluing amount of 36% and a uniformity of 1.3%.
[0052] c. Lay the phenolic resin sheet and resin-impregnated paper together, place them in a press for pressing, the pressing temperature is 90°C, the pressing pressure is 4 MPa, and the pressing time is 30 minutes.
[0053] Results: The warpage of the plate was less than 1%, and the adhesion was good. The cpk of the drilled hole was 1.55, th...
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