Method for manufacturing multilayer circuit board

Abstract

The invention provides a method for manufacturing a multilayer circuit board, which comprises the following steps of: providing a first circuit substrate and a second circuit substrate, wherein the first circuit substrate comprises a first circuit layer and a first substrate layer, and the second circuit substrate comprises a first conductive layer and a second substrate layer; laminating the second circuit substrate on the surface of the first circuit layer so as to form a laminated board, wherein the second substrate layer is in contact with the first circuit layer; forming a first via holein the laminated board by adopting a mechanical drilling process, wherein the first via hole at least penetrates through the first conductive layer; forming a second via hole in the laminated board by adopting a laser drilling process, wherein the second via hole is communicated with the first via hole so as to compose a first blind hole, and the first blind hole at least penetrates through the first conductive layer and the second substrate layer; making a first blind guide hole from the first blind hole, so that the first blind guide hole is electrically connected with the first conductive layer and the first circuit layer; and patterning the first conductive layer so as to form a conductive circuit in the first conductive layer.

Description

Technical field [0001] The invention relates to a circuit board manufacturing technology, in particular to a manufacturing method of a multilayer circuit board. Background technique [0002] In the information, communication and consumer electronics industries, circuit boards are an indispensable basic component of all electronic products. With the development of electronic products in the direction of miniaturization and high-speed, circuit boards have also developed from single-sided circuit boards to double-sided circuit boards and multilayer circuit boards. Multi-layer circuit boards are widely used due to their larger wiring area and higher assembly density. Please refer to Takahashi, A. et al. in 1992 published in IEEE Trans. on Components, Packaging, and Manufacturing Technology "High density multilayer printed circuit board for HITACM~880". [0003] The multi-layer circuit board has multiple conductive layers, and the multiple conductive layers realize signal connection t...

AI Technical Summary

Problems solved by technology

This makes the manufacturing process more complicated, increases the manufacturing precision requirements, and reduces the manufacturing efficiency.

In addition, in the prior art, only the mechanical drilling process or the laser drilling process is generally used for the drilling process in making the guide hole.

However, the manufacturing accuracy of mechanical drilling is slightly lacking, while laser drilling is more accurate but slower when using laser drilling for conductive layers

Images