Unlock instant, AI-driven research and patent intelligence for your innovation.

A destructive physical analysis method used for astronavigation-used stacked packaged devices

A stacked packaging and physical analysis technology, applied in the analysis of materials, instruments, etc.

Inactive Publication Date: 2014-11-05
CHINA ACADEMY OF SPACE TECHNOLOGY
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Neither the current national military standard GJB4027A nor the US military standard MIL-STD-1580B clearly stipulates the destructive physical analysis method for such stacked package devices

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A destructive physical analysis method used for astronavigation-used stacked packaged devices
  • A destructive physical analysis method used for astronavigation-used stacked packaged devices
  • A destructive physical analysis method used for astronavigation-used stacked packaged devices

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0042] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0043] Embodiments of the present invention refer to Figure 1-20 shown.

[0044] A method for destructive physical analysis of package-on-package devices used in aerospace, extracting 10% from a batch of package-on-package devices for destructive physical analysis, comprising the following steps:

[0045] Step 1, inspect the tantalum shielding case of the package-on-package device, if the package-on-package device does not have a tantalum shielding case, go to step 2; if the package-on-package device has a tantalum shielding case, inspect the tantalum shielding case, specifically including Follow the steps below:

[0046] Step 1.1, as in Figure 5 , 6 As shown, visual inspection of the tantalum shielding case: check the gap at the seam of the tantalum shielding case, if the gap between the tantalum shielding case exceeds 50% of the thickness of the...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A destructive physical analysis method used for astronavigation-used stacked packaged devices, and the method comprises the following steps: step 1, checking the tantalum shielding case of the stacked packaged devices, and if the stacked packaged devices do not have a stacked package tantalum shielding case, proceeding to step 2; and if the stacked package devices have a tantalum shielding case, then checking the tantalum shielding case; step 2, performing visual inspection to gold conduction bands having the function of achieving electrical connection and being packaged in the outermost layer of the stacked packaged devices; step 3, performing X-ray inspection for the stacked packaged devices; step 4, performing solderability and soldering heat resistance inspection for the stacked packaged devices; step 5, taking no less than 50% of the stacked packaged devices from the remaining stacked packaged devices in step 4, to perform an inspection by using a layer-by-layer removing method for the internal substrates of the stacked packaged devices; step 6, performing cross-section inspection for the stacked packaged devices not being subjected to inspection in step 5; and step 7, performing materials analysis to the stacked packaged devices.

Description

technical field [0001] The invention relates to a destructive physical analysis (DPA destructive physical analysis) method, in particular to a destructive physical analysis method for stacked packaging devices used in aerospace. Background technique [0002] The implementation of DPA is to verify whether the design, structure, material, manufacturing quality and process of electronic components meet the intended purpose or the requirements of relevant specifications, as well as whether they meet the reliability and guarantee specified by the components, and dissect the components samples , and the whole process of conducting a series of inspections and analyzes after the money is dissected. DPA is an important technical means developed in response to the electronic system's higher requirements for the reliability of components and components in order to improve the quality of components and ensure the reliability of the entire electronic system. [0003] The current DPA met...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G01N35/00
Inventor 段超王旭成亮陈雁孟猛龚欣张伟倪晓亮张延伟
Owner CHINA ACADEMY OF SPACE TECHNOLOGY