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Two-dimensional thermoelectric refrigerator electrical model with non-uniform substrate temperature being considered

A thermoelectric cooler and substrate temperature technology, which is applied in the direction of instruments, electrical digital data processing, special data processing applications, etc., can solve problems such as the influence error of TEC performance, and achieve the effect of improving reliability and system performance

Inactive Publication Date: 2013-05-08
SUZHOU R&D CENT OF NO 214 RES INST OF CHINA NORTH IND GRP
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Problems solved by technology

Considering that the horizontal cross-sectional size of the TEC integrated in the package is much larger than its height, and the current TEC products adopt the form of multi-level thermoelectric coupling pairs, only considering the influence of the temperature distribution in the vertical direction on the performance of the TEC will inevitably cause errors

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  • Two-dimensional thermoelectric refrigerator electrical model with non-uniform substrate temperature being considered
  • Two-dimensional thermoelectric refrigerator electrical model with non-uniform substrate temperature being considered
  • Two-dimensional thermoelectric refrigerator electrical model with non-uniform substrate temperature being considered

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Embodiment Construction

[0035] The present invention will be further described below in conjunction with the accompanying drawings. The following examples are only used to illustrate the technical solution of the present invention more clearly, but not to limit the protection scope of the present invention.

[0036] TEC has the characteristics of easy integration, small size, strong anti-interference ability, high reliability, and long life, making it one of the hot spots in the research of cooling materials and widely used in aerospace, medical, laser and other fields. Figure 1 shows a cross-sectional view of a package-integrated TEC used to cool hot spots. The TEC chain consists of multi-level thermocouples composed of p-type Si and n-type Si connected together through Cu plates. When current flows from n-type Si material to p-type Si, based on the Peltier effect, heat is absorbed at the bottom of the TEC, producing a cooling effect, while heat is released at the top. If the power supply electrod...

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Abstract

The invention discloses a two-dimensional thermoelectric refrigerator electrical model with non-uniform substrate temperature being considered. The two-dimensional distributed electrical model considering the substrate temperature distribution and the temperature distribution of thermoelectric cooler (TEC) in the direction of height, an electrical model based on Hspice is established, based on the duality of the multi-stage TEC chain and the thermoelectricity in electrical series and thermal parallel connection; the influence of the temperature distribution on the TEC parameters is revised through multiple iterations and the temperature distribution can be provided finally. The two-dimensional thermoelectric refrigerator electrical model with the non-uniform substrate temperature being considered according to the influence of the substrate temperature distribution on the two-dimensional temperature control parameters, proposes a distributed electric network model which can accurately estimate the cooling ability of the TEC, and provides a feasible heat dissipation solution for improving the reliability of the chip and the performance of the system.

Description

technical field [0001] The invention relates to an electrical model of a thermoelectric cooler, in particular to a two-dimensional thermoelectric cooler electrical model considering non-uniform substrate temperature. Background technique [0002] In order to effectively solve the heat dissipation problem of the chip, the thermoelectric cooler as an active heat dissipation device has become an important cooling and heat dissipation device with its unique advantages, which can effectively suppress the temperature rise of the hot spot in the chip. Compared with the traditional forced air convection cooling method, the thermoelectric cooling method has attracted people's attention due to its advantages of high control precision and good uniformity of chip surface temperature. According to the chip temperature distribution, the thermoelectric cooler integrated in the package can dynamically adjust the cooling intensity to meet the performance needs. While effectively reducing th...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F19/00
Inventor 王宁汪健陈亚宁王少轩张磊赵忠惠
Owner SUZHOU R&D CENT OF NO 214 RES INST OF CHINA NORTH IND GRP
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