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Liquid curable epoxy resin composition and adhesive agent containing same

An epoxy resin, curable technology, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problem of no storage stability, curability, adhesion, etc.

Inactive Publication Date: 2013-05-08
NIPPON SODA CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is no description about the storage stability, curability, and adhesiveness of the application as a liquid curable epoxy composition.

Method used

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  • Liquid curable epoxy resin composition and adhesive agent containing same
  • Liquid curable epoxy resin composition and adhesive agent containing same
  • Liquid curable epoxy resin composition and adhesive agent containing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0166] Examples are shown below, but the present invention is not limited by these Examples.

[0167] Hereinafter, the inclusion complex may be referred to as a catalyst or a curing catalyst.

[0168] Preparation of I inclusion complexes

[0169] [Reference Example 1] (b1) When the host compound is an aromatic carboxylic acid

[0170] [Reference example 1-1]

[0171] 180.0 g of 5-tert-butylisophthalic acid and 107.1 g of 2E4MZ were added to 810 ml of methanol, followed by stirring and heating to reflux for 3 hours. After cooling, filtration and vacuum drying were performed to obtain 201.3 g of the inclusion compound 5-tert-butylisophthalic acid / 2E4MZ (inclusion ratio 1 / 1). use 1 H-NMR, TG-DTA and XRD confirmed that the obtained inclusion complex was an inclusion complex (sample number 4).

[0172] In addition to using the compound (b1) in Table 1 instead of 5-tert-butylisophthalic acid, and the compound (b2) in Table 1 instead of 2E4MZ, use the same method as in Reference...

reference example 2

[0188] [Reference Example 2] (b1) Example in which the main compound is an aliphatic polycarboxylic acid

reference example 2-1

[0190] Mix trans-1,4-cyclohexane-dicarboxylic acid (17.2 g, 100 mmol) and 2E4MZ (11.0 g, 100 mmol) in 75 ml of methanol, stir and heat to reflux. Thereafter, heating was stopped, and cooling was performed. After standing to cool at room temperature overnight, the precipitated crystals were filtered and vacuum-dried.

[0191] use 1 H-NMR, TG-DTA and XRD confirm that the obtained trans-1,4-cyclohexane-dicarboxylic acid-2-ethyl-4-methylimidazole inclusion complex is an inclusion complex (sample number 25) .

[0192] In the same manner as in Reference Example 2-1, except that the compound (b1) in Table 2 was used instead of trans-1,4-cyclohexane-dicarboxylic acid, and the compound (b2) in Table 2 was used instead of 2E4MZ Synthesis of inclusion complexes (Sample No. 26, 27). The imidazole content was calculated in the same manner as in Reference Example 1 above.

[0193] In addition, except that acetone was used instead of methanol, inclusion complexes (sample numbers 29 and ...

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Abstract

The present invention addresses the problem of providing: within a composition containing an epoxy resin, a curable epoxy resin composition with excellent storage stability and excellent curing properties that provides a cured material having excellent properties, particularly excellent organic solvent resistance; an adhesive agent comprising said composition; and an adhesive comprising a curable epoxy resin composition with excellent adhesive strength. The curable epoxy resin composition of the present invention is a liquid curable epoxy resin composition that contains (A) and (B), below. (A) An epoxy resin or epoxy polyester hybrid resin; (B) An inclusion complex containing (b1) and (b2); (b1) A carboxylic acid compound etc., indicated by the formula A(COOH)a (wherein A indicates a C1-C6 chain hydrocarbon group that may have a substituent group, a C3-C10 monocyclic hydrocarbon group that may have a substituent group, or a C6-C10 bicyclic hydrocarbon group that may have a substituent group, and a indicates 2 or 3); and (b2) A compound indicated by formula (II) and at least one type selected from a group comprising 1,8-diazabicyclo[5.4.0]undecene-7.

Description

technical field [0001] The present invention relates to a liquid curable epoxy resin composition excellent in storability, curability, and adhesiveness, and an adhesive composed of the composition. [0002] This application applies to Japanese patent application No. 2010-206622 filed on September 15, 2010, Japanese patent application No. 2010-207043 filed on September 15, 2010, and Japanese patent application filed on January 28, 2011 Application No. 2011-016790 claims priority, the content of which is incorporated herein by reference. Background technique [0003] Epoxy resins are widely used in various fields because of their excellent mechanical properties and thermal properties. For example, it is used as an adhesive for electronic components due to its unique insulating properties and thermosetting properties. For these thermosetting adhesives, it is required that the thermosetting resin and the curing agent exist stably in an unreacted state before use, and are requi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/40C08G59/68C09J163/00
CPCC08G65/02C08G59/62C09J163/00C08G59/4207C08G59/42C08G59/5073C08G59/56C08G59/40C08G59/68C08L63/00
Inventor 龟谷直幸小野和男天池正登野村智哉
Owner NIPPON SODA CO LTD
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