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Resin composition and manufacturing process therefor

A technology of resin composition and manufacturing method, applied in the direction of polyamide paint, coating, etc., can solve problems such as unfitness, viscosity drop over time, etc., and achieve excellent heat resistance and excellent storage stability.

Active Publication Date: 2013-05-22
TORAY IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the solution of polyamic acid, which is a precursor of the polyimide, has a problem that its viscosity decreases over time.
Therefore, it is not suitable for use as the above-mentioned coating agent

Method used

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  • Resin composition and manufacturing process therefor
  • Resin composition and manufacturing process therefor
  • Resin composition and manufacturing process therefor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0118] 1.96g (9mmol) of PMDA, 1.08g (10mmol) of PDA, and 30g of NMP were added to a 100mL four-neck flask under dry nitrogen flow, and heated and stirred at 50°C. After 2 hours, 2.05 g (9 mmol) of DABA and 3.24 g (11 mmol) of BPDA were added and heated and stirred. After a further 2 hours, 0.218 g (2 mmol) MAP was added and stirred. After 1 hour, cool to make a varnish.

Embodiment 2

[0120] Under dry nitrogen flow, add 1.96g (9mmol) PMDA, 1.08g (10mmol) PDA, 30g NMP into 100mL four-neck flask, heat and stir at 50°C. After 2 hours, 2.05 g (9 mmol) of DABA and 3.24 g (11 mmol) of BPDA were added and heated and stirred. After a further 2 hours, 0.204 g (2 mmol) of HexOH were added and stirred. After 1 hour, cool to make a varnish.

Embodiment 3

[0122] Under dry nitrogen flow, add 1.96g (9mmol) PMDA, 1.19g (11mmol) PDA, 30g NMP into 100mL four-neck flask, heat and stir at 50°C. After 2 hours, 2.05 g (9 mmol) of DABA and 2.94 g (10 mmol) of BPDA were added and heated and stirred. After a further 2 hours, 0.196 g (2 mmol) MA was added and stirred. After 1 hour, cool to make a varnish.

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Abstract

Provided is a polyamic acid resin composition which exhibits excellent storage stability and which can yield, through heat treatment, a film having excellent heat resistance. The polyamic acid resin composition is characterized by comprising (a) a polyamic acid which comprises structures represented by general formula (1) in an amount of at least 80% of all the repeating units and (b) a solvent. In general formula (1), A is a polyamic acid block represented by general formula (2); B is a polyamic acid block represented by general formula (3); and k is a positive integer. In general formula (2), Ws are divalent organic groups each having two or more carbon atoms, and are mainly composed of divalent organic groups represented by general formula (4); Xs are tetravalent organic groups each having two or more carbon atoms, exclusive of the groups represented by general formulae (5) and (6), while in general formula (3), Ys are divalent organic groups each having two or more carbon atoms, exclusive of the groups represented by general formula (4); Zs are tetravalent organic groups each having two or more carbon atoms, and are mainly composed of tetravalent organic groups represented by general formula (5) or (6). In general formulae (2) and (3), ms and ns are positive numbers respectively, and may be respectively different among blocks. In general formulae (4) to (6), R1 to R5 may be each a single monovalent C1-10 organic group or a mixture of different monovalent C1-10 organic groups; o and p are each an integer of 0 to 4; q is an integer of 0 to 2; and r and s are each an integer of 0 to 3.

Description

technical field [0001] The present invention relates to a polyamic acid resin composition. More specifically, it relates to flexible substrates such as flat panel displays, electronic paper, and solar cells, surface protection films for semiconductor elements, interlayer insulating films, insulating layers or spacers for organic electroluminescence elements (organic EL elements), and thin film transistors. A polyamic acid resin composition suitable for use in flattening films of substrates, insulating layers of organic transistors, flexible printed circuit boards, and binders for electrodes of lithium-ion secondary batteries. Background technique [0002] Compared with glass, organic film has the characteristics of rich flexibility and less breakage. Recently, there has been active activity to make displays more flexible by replacing the substrate of flat panel displays with an organic film from the conventional glass. [0003] When producing a display on an organic film, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10
CPCC08G73/028C09D177/12C08L79/08C08G73/1071C08G73/1042C08G73/1067C08G73/14C08G73/10
Inventor 宫崎大地三好一登富川真佐夫
Owner TORAY IND INC