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Electrochemically powered integrated circuit packaging

An integrated circuit and electrode technology, which is applied in the field of integrated circuit packaging for electrochemical power supply

Inactive Publication Date: 2016-01-20
INT BUSINESS MASCH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there remains the question of feasible ways to supply electrical energy

Method used

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  • Electrochemically powered integrated circuit packaging
  • Electrochemically powered integrated circuit packaging
  • Electrochemically powered integrated circuit packaging

Examples

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Embodiment Construction

[0034] As an introduction to the description below, reference is first made to a general aspect of the invention, which relates to an integrated circuit package. The package has a layer structure with electrodes and ICs arranged in electrical connection with the layers of the layer structure. The package also includes fluid circuit segments, each for receiving a respective electrolyte solution (or two distinct solutions, see dual flow redox mode described below). Each solution involved has a soluble electroactive species. The fluid segments are designed to receive and allow the electrolyte solution to contact the corresponding electrodes to supply electrical power to the IC in operation. Since the electrodes are integrated into the package, power can be supplied close to the IC, thereby improving the efficiency of power supply. High energy densities can also be achieved due to forced convection of the electrochemical solution contacting the electrodes. Finally, since the li...

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Abstract

The invention particularly relates to an integrated circuit package (10c). The package has a layer structure with electrodes and an IC (17) arranged in electrical connection with a layer (16) of the layer structure. The package also includes one or more fluid circuit segments (19), each for receiving a respective electrolyte solution (or two distinct solutions, see dual flow redox mode described below). Each solution involved has a soluble electroactive species. The fluid segments are designed to receive and allow the electrolyte solution to contact the corresponding electrodes to supply electrical power to the IC in operation. Since the electrodes are integrated into the package, power can be supplied close to the IC, thereby improving the efficiency of power supply. Finally, since the liquid is contained in situ, proper heat removal can be envisaged, noting that the needs for electrical energy delivery and heat removal are consistent.

Description

technical field [0001] The present invention relates to electrochemically powered integrated circuit packages, such as those provided in computer systems such as data centers. In particular, the present invention relates to integrated circuit packages powered via an electrolytic solution having a soluble electroactive material for supplying electrical energy to the packaged integrated circuits. Consistently, the invention also relates to a computer system equipped with such a circuit package and a method of operating the computer system. Background technique [0002] Increasing integration density in planar integrated circuits (ICs) results in reduced feature sizes and denser packing of components. Although transistor switching speed benefits from this development, the delay time due to on-chip wiring increases significantly and limits the overall performance of the IC. [0003] As is known, three-dimensional (3D) integration of ICs dramatically reduces wiring lengths by p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/58
CPCH01L23/34H01L23/44H01L23/473H01L23/58H01M8/04029H01M8/04276H01M8/1097H01M8/188H01L2224/16145H01L2224/16225H01L2224/32225H01L2224/73204H01L2924/15311Y02E60/50H01L2924/00H01L23/49593
Inventor T·J·布伦施维勒B·米歇尔P·鲁赫
Owner INT BUSINESS MASCH CORP