Cutting method and cutting system of single-layer array glass substrate

Abstract

The present invention relates to the field of display technology, in particular to a single-layer array glass substrate cutting method and cutting system that utilizes a simulated glass substrate and a single-layer array glass substrate to be combined and installed to realize a simulated double-layer glass substrate cutting process; the method includes: The single-layer array glass substrate after the array process and the provided simulated glass substrate are assembled into a double-glass simulated substrate through an incorporation process; the double-glass simulated substrate is sent to a cutting machine for cutting to form a double-glass simulated substrate and performing a separation process on the double-glass analog substrate to obtain a single-layer array glass substrate. The present invention adopts the method of installing the simulated glass substrate on the single-layer array glass substrate, and protects the array units through the simulated glass substrate, so as to avoid damage to the array due to glass splashing in the suspension cutting mode or the non-suspension cutting mode. The scratches generated by the unit solve the adaptability problem between the double wheel spacing and the thickness of the single-layer array glass substrate in the suspended cutting mode.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to a single-layer array glass substrate cutting method and a cutting system that utilizes a simulated glass substrate and a single-layer array glass substrate to be combined and installed to realize a simulated double-layer glass substrate cutting process. Background technique [0002] At present, for the cutting field of glass substrates for display devices, the most common is the cutting process of double-layer glass substrates, such as LCD substrates; usually for double-layer glass substrates, cutting is mainly carried out by cutting machines using suspension cutting mode ;Because the double-layer glass plate can effectively protect the various components installed inside it, it can effectively avoid the splashed glass particles generated by the double-wheel cutting device from scratching the internal components; and on the transfer table through the chuck When clamping,...

AI Technical Summary

Problems solved by technology

[0003] However, if the suspension cutting mode is used to cut single-layer array glass substrates, such as TOUCH or OLED substrates, it is obviously not applicable, and the yield rate of finished products will be low; the main reason is that the array unit of the single-layer array glass substrate is set on the glass On the substrate, that is to say, when the double-wheel cutting device performs opposite point-to-point cutting, it is easy to cause the splashed glass particles to scratch the array unit; Adjusting the wheelbase of the wheel will easily lead to the unfavorable phenomenon due to double-wheel blessing. Specifically, only the upper cutting wheel cuts, while the lower cutting wheel cannot touch the glass substrate due to the long distance. The glass substrate forms a point-to-point cutting, which will cause the glass substrate to be uneven or even damaged; thus increasing the defective rate of the single-layer array glass substrate

Moreover, when the single-layer array glass substrate is clamped by the chuck on the transfer table, since the array unit is covered and protected, it is obvious that the chuck is easy to cause physical damage to it.

[0004] Based on the above reasons, the existing cutting process for single-layer array glass substrates mostly adopts the non-suspension cutting mode. Although this mode can cut the glass substrate with a single cutting wheel and avoid the problem of glass substrate incision damage, but in When the single-wheel cutting device cuts, it will also generate splashed glass particles, which will scratch the array unit; at the same time, it is impossible to avoid the damage to the array unit caused by the chuck when clamping

Images