Bonder

A bonding device and bonding technology, applied in the field of bonding, can solve problems such as unqualified products, different bonding effects of chips, and reduced product qualification rate

Active Publication Date: 2013-06-05
NAT CENT FOR ADVANCED PACKAGING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the bonding effect of the chip is closely related to the applied pressure, the traditional bonding process will cause different bonding effects of multiple chips bonded at the same time.
In this case, it is easy to produce unqualified products, which reduces the qualified rate of products

Method used

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Embodiment Construction

[0023] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described The embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0024] Such as figure 1 As shown, a bonding device provided by an embodiment of the present invention is used for bonding the closely connected first object to be bonded 300 and the second object to be bonded 400, and the bonding device includes: a pressure cover 100 and the elastic pressure membrane 200 attached to the opening of the ...

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PUM

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Abstract

The invention discloses a bonder which comprises a pressure cover and an elastic pressure film attached at an opening of the pressure cover. As the elastic pressure film can deform along with the surface of an object contacting with the elastic pressure film, the pressure intensity on the elastic pressure film is the same, and the elastic pressure film can uniformly apply pressure on a first object to be bonded. When the first object to be bonded comprises a plurality of bonding objects with different thicknesses, the bonder applies the same pressure intensity on the bonding objects with the different thicknesses, so that bonding effects of the bonding objects are the same, and the qualified rate of products can be increased.

Description

technical field [0001] The invention relates to the field of bonding technology, in particular to a bonding device. Background technique [0002] With the rapid development of microelectronic chips in the direction of high speed, high density and high performance, people have higher and higher requirements for the reliability of electronic packaging. The chip bonding process is a key process in electronic wafer-level and board-level packaging. As the size of the chip shrinks, people's requirements for this process are becoming more and more stringent. [0003] In order to improve the efficiency of the bonding process, multiple chips need to be bonded simultaneously. The traditional bonding process exerts pressure on the chip through a metal bonding pad driven by hydraulic pressure or air pressure. When multiple chips are pressed at the same time, different pressures will be applied to chips of different thicknesses due to the difference in the thickness of each chip. When ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/603
Inventor 万里兮郭学平宋崇申
Owner NAT CENT FOR ADVANCED PACKAGING
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