Uniform axial force applying device for graphical heterogeneous bonding of silicon-based III-V epitaxial material

Abstract

The invention discloses a uniform axial force applying device for graphical heterogeneous bonding of a silicon-based III-V epitaxial material. The uniform axial force applying device comprises a lower force applying cover plate, a lower bearing support, an upper force applying support, a planoconvex lens and an upper force applying cover plate, wherein the lower force applying cover plate is wafer-shaped; the lower bearing support is wafer-shaped and is positioned on the lower force applying cover plate, and a plurality of round holes are uniformly distributed on the upper surface of the lower bearing support; the upper force applying support is wafer-shaped and is positioned on the lower force bearing support, and a plurality of round holes are uniformly distributed on the upper surface of the upper force applying support; and the lower bearing support and the upper force applying support are connected by a plurality of directional cylinders in an inserting manner; two protective accompanying pieces are also arranged between the lower bearing support and the upper force applying support and are superimposed from top to bottom; the planoconvex lens is positioned on the upper force applying support; and the upper force applying cover plate is wafer-shaped, and is positioned on the planoconvex lens. The uniform axial force applying device has the characteristics that the whole axial pressure applying method does not adopt a direct pressurizing mode, but a leveling part, the force bearing parts and the protective parts are added, so that the uniform pressure applying is realized; and a target chip can bear larger pressure without fragmentation, so that the firmer bonding is realized.

Description

technical field [0001] The invention relates to the technical field of photonic optoelectronic devices and chip manufacturing, in particular to a silicon-based III-V epitaxial material pattern heterogeneous bonding uniform axial force applying device, which is used for mixing silicon-based photon, optoelectronic active and passive Fabrication of devices or chips, suitable for photonic optoelectronic integration applications. Background technique [0002] Silicon-based semiconductors are the cornerstone of the modern microelectronics industry, but they are reaching their limits, especially when it comes to interconnects. However, optoelectronic technology is in a stage of rapid development. Today's semiconductor light-emitting devices are mostly made of compound materials, which are not compatible with silicon microelectronics technology. Therefore, it is meaningful to integrate photonic technology and microelectronic technology to develop silicon-based optoelectronics scienc...

AI Technical Summary

Problems solved by technology

It will lead to two problems: First, even if the force application system is absolutely parallel, if the parallelism of the wafer deviates, the force will be uneven

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