Heat dissipation device

Abstract

The invention relates to a heat dissipation device comprising a base seat and multiple heat dissipation fins, wherein the heat dissipation fins are parallel arranged along a first direction, all the heat dissipation fin are provided with multiple fin parts, all the fin parts are arranged at an interval along a second direction, the second direction is substantially perpendicular to the first direction, a groove part is formed between neighboring two fin parts of the same heat dissipation fin, positions of all the fin parts of all the heat dissipation fins correspond to positions of all groove parts of neighboring heat dissipation fins, and therefore heat dissipation air flows can smoothly and effectively run through all the heat dissipation fins.

Description

【Technical Field】 [0001] The invention relates to a heat dissipation device and an assembly method thereof, in particular to a heat dissipation device with staggered fins and an assembly method thereof. 【Background technique】 [0002] With the continuous development of the electronic information industry, electronic equipment, such as a central processing unit (CPU) or a graphics processing unit (GPU), has an increasing demand for operating frequency and computing capacity. However, with the high operating frequency and high computing capacity, the heat generated by the electronic equipment also increases, causing the temperature of the electronic equipment itself and the surroundings to continue to rise, which seriously threatens the efficiency of its operation. In order to ensure the normal operation of electronic equipment, a large amount of waste heat generated by the electronic equipment must be discharged in time to prevent the electronic equipment from overheating and affe...

AI Technical Summary

Problems solved by technology

[0004] In view of the above problems, the present invention provides a heat sink with misaligned fins, so as to solve the problems of conventional heat sinks

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