Scraper, solder paste coating machine with scraper and method for scraping solder paste

A coating machine and scraper technology, applied in printing machines, rotary printing machines, screen printing machines, etc., can solve problems such as solder paste hardening and solder paste residue

Inactive Publication Date: 2013-06-12
ASKEY TECH JIANGSU +1
View PDF6 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the amount of solder paste is too large, the scraper 2 still cannot avoid solder paste remaining on the outside of the scraper, and the solder paste accumulates on the working platform for a long time and hardens
[0007] Therefore, how to solve the problems in the prior art that the solder paste remains on the outside of the scraper and the solder paste accumulates on the working platform for a long time and hardens has become a problem to be solved at present.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Scraper, solder paste coating machine with scraper and method for scraping solder paste
  • Scraper, solder paste coating machine with scraper and method for scraping solder paste
  • Scraper, solder paste coating machine with scraper and method for scraping solder paste

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0046] The implementation of the present invention is illustrated by specific specific examples below, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0047] It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification, for those who are familiar with this technology to understand and read, and are not used to limit the implementation of the present invention. Limiting conditions, so there is no technical substantive meaning, any modification of structure, change of proportional relationship or adjustment of size, without affecting the effect and purpose of the present invention, should still fall within the scope of the present invention. The disclosed technical content must be within the scope covered. At the same time, terms such as "upper", "low...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a scraper. The scraper is characterized in that second scraper blades are respectively arranged on two opposite sides of a first scraper blade. When the scraper executes the solder paste scraping action on a worktable of the solder paste coating machine, solder paste overflowing out of two sides of the first scraper blade is toggled into the inner side of the first scraper blade by the second scraper blades, so that the solder paste can be prevented from being resided on the outer side of the first scraper blade and further the phenomenon that the solder paste is hardened due to long-time accommodation on the worktable is avoided. In addition, the invention also discloses a solder paste coating machine with the scraper and a scraping method.

Description

[0001] technical field [0002] The invention relates to a scraper, in particular to a scraper which can prevent solder paste from remaining on the outside of the scraper during scraping off the solder paste. Background technique [0003] Surface mount technology or surface mount technology (Surface Mount Technology; SMT for short) is mainly an assembly technology used in electronic products. The assembly method is to first apply solder paste to the printed circuit board (Printed Circuit Board; PCB), and then solder the surface-mounted electronic components, such as resistors, capacitors, transistors and / or integrated circuits (Integrated Circuit; IC for short), on the printed circuit board. [0004] In the existing solder paste coating technology, such as Figure 1A As shown, it first places a screen 10 on the working platform 90 of a solder paste coating machine 9, then places the circuit board (not shown) under the screen 10, and then coats the solder paste 11 on the scre...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): B41F15/46B41F15/08
Inventor 张绍均谢青峰
Owner ASKEY TECH JIANGSU
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products