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Imaging mechanism and endoscope apparatus

一种安装面、保持构件的技术，应用在内窥镜、望远镜、图像通信等方向，能够解决硬质部长度变长、尺寸变大等问题，达到抑制大型化的效果

Active Publication Date: 2013-07-03
EVIDENT CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in conventional endoscope devices, if the image sensor that can be mounted in the insertion part is to be provided as a high-quality and large-scale image sensor, hard parts including signal lines and the like connected to the image sensor are required. The size also increases, the insertion part has a large diameter, or the length of the hard part of the insertion part becomes longer.

Method used

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  • Imaging mechanism and endoscope apparatus
  • Imaging mechanism and endoscope apparatus
  • Imaging mechanism and endoscope apparatus

Examples

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Embodiment Construction

[0022] The imaging mechanism 8 and the endoscope apparatus 1 according to one embodiment of the present invention will be described. figure 1 It is an overall view showing the endoscope apparatus 1 of this embodiment. figure 2 It is a cross-sectional view of the distal end portion of the insertion portion 2 in the endoscope device 1 . image 3 It is a perspective view of the imaging mechanism 8 provided in the endoscope apparatus 1 . Figure 4 is a cross-sectional view of the imaging mechanism 8 . Figure 5 It is a figure which looked at the imaging mechanism 8 of this embodiment from a proximal end toward a distal end. Image 6 It is a figure which looked at the imaging mechanism 8 from a distal end toward a proximal end.

[0023] Such as figure 1 As shown, the endoscope device 1 includes a vertically long insertion part 2 inserted into the inside of the object to be observed from the distal end, an operation part 40 provided at the proximal end of the insertion part 2, ...

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PUM

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Abstract

An imaging mechanism and an endoscope apparatus include: an image sensor including a sensor face and a plurality of input / output leads, a holding member having a sensor contact face contacted with one face of an opposite side of the image sensor to the sensor face, a circuit board that is secured to an outer face of an opposite side of the holding member to the sensor contact face and has a mounting surface in parallel to the sensor face, and a contact-point part disposed on a side face of the circuit board intersecting with a mount face, and in a region where the outline of the circuit board is inside the outline of the holding member. At least one of the holding member and the circuit board includes a relay wiring part which the contact-point part and at least one of the input / output leads are electrically connected to.

Description

technical field [0001] The invention relates to an imaging mechanism and an endoscope device. Background technique [0002] Conventionally, it is known to insert an endoscope apparatus into the inside of the object to be observed when observing the inside of the object to be observed. For example, there is known an endoscope device having a vertically long insertion portion, the insertion portion has a distal end and a proximal end, and an imaging device for imaging an object is arranged at the distal end of the insertion portion. mechanism. [0003] As an example of such an imaging mechanism, Japanese Unexamined Patent Publication No. 2006-68058 discloses a distal end portion of an electronic endoscope. In the electronic endoscope described in Japanese Unexamined Patent Application Publication No. 2006-68058, a substrate on which a solid-state imaging element (image sensor) is mounted and a signal line electrically connected to the image sensor are sealed inside a resin a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B23/24H04N5/225H04N25/00
CPCA61B1/051
Inventor 膳健一
Owner EVIDENT CORP
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