Low-acidity phenolic foam and preparation method thereof

A phenolic foam and low-acidity technology, which is applied in the field of low-acidity phenolic foam and its preparation, can solve the problems of high acid consumption, hidden dangers, and large residual amount of curing agent, so as to reduce acidity, avoid foaming and collapse, and cross-linking and curing speed up effect

Active Publication Date: 2013-07-10
INST OF CHEM CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The curing agent of phenolic foam is an acid curing agent, so the prepared phenolic foam is acidic. Due to the high amount of acid used in the foaming formula and the large amount of residual curing agent in the foams currently sold in the market, most of the phenolic foams are relatively strong acidity. The pH value is 2 to 3, and the hidden dangers brought by it cannot be ignored

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Embodiment 1, preparation low-acid phenolic foam

[0028] At 15-25°C, 100 parts by mass of expandable phenolic resin (the molar ratio of formaldehyde and phenol is 2.0:1, the viscosity is 110000mPa·s, the number average molecular weight is 453, the water content is 8.25wt%, and the solid content is 91.90wt%, free phenol 5.03%, free aldehyde is 1.29wt%, pH is 7.58), 3 mass parts surfactant (tween-80), 5 mass parts foaming agent (n-pentane), 5 mass parts acid Curing agent solution (70wt% phenyl phosphate solution), mixed evenly, and cured at 90°C for 15 minutes to obtain phenolic foam, which was taken out and placed at room temperature. The resulting phenolic foam is not full of the mold due to poor emulsification effect and is not fine and smooth. The closed cell ratio is 3.48%, the pore diameter is 200 μm to 300 μm, and the pH value is 3.98.

Embodiment 2

[0029] Embodiment 2, prepare low-acid phenolic foam

[0030] At 15-25°C, 100 parts by mass of expandable phenolic resin (the molar ratio of formaldehyde and phenol is 2.0:1, the viscosity is 110000mPa·s, the number average molecular weight is 453, the water content is 8.25wt%, and the solid content is 91.90wt%, free phenol 5.03%, free aldehyde is 1.29wt%, pH is 7.58), 5 mass parts surfactant (Tween-80), 5 mass parts blowing agent (n-pentane), 5 mass parts acid Curing agent solution (70wt% phenyl phosphate solution), mixed evenly, and cured at 90°C for 15 minutes to obtain phenolic foam, which was taken out and placed at room temperature. The obtained phenolic foam has a uniform appearance, a closed cell ratio of 11.79%, a pore diameter of 150 μm to 200 μm, and a pH value of 4.07.

Embodiment 3

[0031] Embodiment 3, preparation low acid phenolic foam

[0032] At 15-25°C, 100 parts by mass of expandable phenolic resin (the molar ratio of formaldehyde and phenol is 2.0:1, the viscosity is 110000mPa·s, the number average molecular weight is 453, the water content is 8.25wt%, and the solid content is 91.90wt%, free phenol 5.03%, free aldehyde is 1.29wt%, pH is 7.58), 7 mass parts surfactant (tween-80), 5 mass parts blowing agent (n-pentane), 5 mass parts acid Curing agent solution (70wt% phenyl phosphate solution), mixed evenly, and cured at 90°C for 15 minutes to obtain phenolic foam, which was taken out and placed at room temperature. The obtained phenolic foam has a uniform appearance, a closed cell ratio of 12.16%, a pore diameter of 150 μm to 200 μm, and a pH value of 4.03.

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Abstract

The invention discloses a low-acidity phenolic foam and a preparation method thereof. The method for preparing low-acidity phenolic foam comprises the steps that foaming phenolic resin, a surface active agent, a foaming agent and an acid curing agent are foamed and cured under 90-130 DEG C to obtain the low-acidity phenolic foam, wherein the ratio of the mass proportions of the foaming phenolic resin, the surface active agent, the foaming agent to the acid curing agent is 100: (3-7): (4-6): (4-6). According to the method, the closed cell rate of the phenolic foam prepared by increasing the foaming temperature and adjusting the consumption amount of the surface active agent, the foaming agent and the acid curing agent is more than 80 percent, the cell diameter of the phenolic foam is 100-130mu m, and the cells are uniform; and the phenolic foam has the same performance as the conventional foaming products, the acidity of the product is lowered, and the pH value is increased to more than 4 from the original 2-3.

Description

technical field [0001] The invention relates to a low-acid phenolic foam and a preparation method thereof. Background technique [0002] Phenolic foam is a new type of thermal insulation material. Because of its good thermal insulation effect and excellent flame retardancy, it has gradually been recognized and widely recognized. However, phenolic foam also has disadvantages such as easy pulverization and strong acidity. [0003] In the 1980s, phenolic foam developed rapidly. The main reason is that phenolic foam has the characteristics of high closed cell rate, low thermal conductivity, good temperature resistance, etc., and has excellent flame retardancy, so it is used in building insulation, air-conditioning, etc. Pipe insulation and other fields. [0004] Phenolic foams at home and abroad have achieved stable industrial production and are widely used. Foreign phenolic foam manufacturers mainly include British KINGSPAN Company, Japan Asahi Kasei Co., Ltd., British Pumloc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J9/14C08L61/06C08G8/10C08K5/42C08K3/30
Inventor 赵彤李昊王娟高建伟金闻
Owner INST OF CHEM CHINESE ACAD OF SCI
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